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Staff Engineer (Wirebond Process Development) page is loaded

Apply locations Seremban posted on Posted 30+ Days Ago job requisition id R-20012807

About the role

The Wire Bond Process Development Staff Engineer is responsible for leading the design, development, and industrialisation of advanced wire bonding processes for semiconductor packages. This role involves working with cross-functional teams to ensure robust, cost-effective, and scalable solutions that support New Product Introductions (NPIs), technology innovation, and high-volume manufacturing.

What you will do

• Lead process development and qualification of wire bonding for packages such as QFN, DFN, BGA, HVQFN, SIP, and power devices

• Drive innovation in fine-pitch, low-loop, multi-tier bonding, and Cu, Ag, Au wire bonding technologies

• Define bonding parameters, wire/capillary specs, loop profiles, and pad layout guidelines for optimal performance and reliability

• Conduct Design of Experiments (DOE) and failure analysis to fine-tune bonding processes for electrical, mechanical, and thermal robustness

• Evaluate and select bonding equipment and tools (e.g., K&S, ASM, Hesse) to support new technology and process scaling

• Lead material characterisation, such as wire-paddle interface, IMC formation, oxidation, and corrosion behavior

• Collaborate with Package Design, NPI, Reliability, and Operations teams to ensure process and product alignment

• Solve complex yield and quality issues, providing in-depth root cause analysis and implementing long-term corrective actions

• Develop documentation and standards, including process flows, control plans, FMEAs, and technical specifications

• Support technology transfer and provide leadership in process ramp-up at internal sites or OSAT partners

What you will need

• Bachelor’s or Master’s Degree in Electronics, Materials Science, Mechanical Engineering, or a related field

• Minimum 8+ years of experience in semiconductor assembly process development, specifically wire bonding

• Strong hands-on experience with wire bonding tools, materials, and defect analysis

• Solid understanding of bonding failure modes, such as NSOL, heel crack, pad lift, wire sweep, and corrosion

• Proficient in statistical tools (JMP, Minitab), SPC, and problem-solving methodologies (8D, DMAIC)

• Strong technical writing, communication, and cross-functional collaboration skills

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

locations Seremban posted on Posted 30+ Days Agolocations Seremban posted on Posted 30+ Days Agolocations Seremban posted on Posted 26 Days Ago

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 12,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

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