Engineer-Jobs in Malaysia

Develop, qualify, and maintain die attach processes for various IC packages, ensuring alignment with design, quality, and customer specifications.

Own troubleshooting and root‑cause analysis for die attach defects such as die tilt, voids, epoxy bleed, non‑stick, and delamination.

Support NPI, package transfer, and process change activities, including DOE, validation, and documentation.

Optimize materials (epoxy, solder, film), equipment parameters, and tooling to improve yield, throughput, and reliability.

Partner with quality, reliability, equipment, and production teams to drive continuous improvement and cost reduction initiatives.

Monitor SPC, process capability, and key performance indicators; lead corrective and preventive actions where required.

Support customer audits, technical discussions, and failure analysis related to die attach processes.

Degree in Engineering (Mechanical, Materials, Chemical, Electrical, or equivalent).

Minimum 3–5 years of hands‑on experience in semiconductor IC packaging, with strong exposure to die attach processes.

Solid understanding of die attach materials, bonding mechanisms, and package reliability fundamentals.

Structured problem‑solving skills with a data‑driven and disciplined execution mindset.

Strong cross‑functional communication and stakeholder management capabilities.