lavori presso Amd in località Malaysia

Set-up wafer bumping process recipe & its verification during internal & external (customer) qualification builds & HVM, review & update document, customer audit/visit support, engineering activities as yield improvement, productivity increment defect analysis & taking corrective action.

Job Responsibilities:

1. Take charge of process control within the designated area, continuously optimizing existing processes to ensure product quality.
2. Handle equipment faults and execute PM plans to maintain a smooth production workflow.
3. Implement and verify cost reduction initiatives within the area of responsibility.
4. Conduct validation work for new processes and materials within the designated area.
5. Collaborate in the acceptance of newly purchased equipment within responsibility area.
6. Manage equipment spare parts, including inventory, procurement, and technical verification.
7. Oversee the management of tools, kits, dummy wafer, and similar resources within the designated area.
8. Develop various operational manuals and guidelines for tasks within the designated area.
9. Conduct training and assessments for operational staff within the designated area.
10. Participate in TPM team activities.

Job Requirements:

• Education on SPC, DOE (miniTab or JMP), FMEA (Failure Mode & Effect Analysis)
• Process engineering experiences in semiconductor field
• Failure analysis & report with Englis.
• Be well-versed in the workflow, understanding process requirements and product quality benchmarks. Also familiar with the materials in use.
• Acquire expertise in the performance, operation, and debugging methods of relevant equipment.