Die Attach Engineer (Semiconductor)

ATX Group; Malacca City; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading tech group in Malaysia seeks an experienced engineer to develop and maintain die attach processes for various IC packages. The role involves troubleshooting defects, supporting new product introduction, and optimizing materials and equipment to enhance yield, throughput, and reliability. Candidates should have a degree in engineering and 3–5 years of experience in semiconductor IC packaging, along with strong problem-solving and communication skills.

Qualifications

• Minimum 3–5 years of hands-on experience in semiconductor IC packaging, with strong exposure to die attach processes.
• Solid understanding of die attach materials, bonding mechanisms, and package reliability fundamentals.

Responsibilities

• Develop, qualify, and maintain die attach processes for various IC packages.
• Own troubleshooting and root-cause analysis for die attach defects.
• Support NPI, package transfer, and process change activities.
• Optimize materials, equipment parameters, and tooling to improve yield.
• Monitor SPC, process capability, and lead corrective and preventive actions.

Skills

Structured problem-solving

Cross-functional communication

Stakeholder management

Education

Degree in Engineering (Mechanical, Materials, Chemical, Electrical, or equivalent)

Job description

Develop, qualify, and maintain die attach processes for various IC packages, ensuring alignment with design, quality, and customer specifications.

Own troubleshooting and root‑cause analysis for die attach defects such as die tilt, voids, epoxy bleed, non‑stick, and delamination.

Support NPI, package transfer, and process change activities, including DOE, validation, and documentation.

Optimize materials (epoxy, solder, film), equipment parameters, and tooling to improve yield, throughput, and reliability.

Partner with quality, reliability, equipment, and production teams to drive continuous improvement and cost reduction initiatives.

Monitor SPC, process capability, and key performance indicators; lead corrective and preventive actions where required.

Support customer audits, technical discussions, and failure analysis related to die attach processes.

Qualifications & Experience

Degree in Engineering (Mechanical, Materials, Chemical, Electrical, or equivalent).

Minimum 3–5 years of hands‑on experience in semiconductor IC packaging, with strong exposure to die attach processes.

Solid understanding of die attach materials, bonding mechanisms, and package reliability fundamentals.

Structured problem‑solving skills with a data‑driven and disciplined execution mindset.

Strong cross‑functional communication and stakeholder management capabilities.