2,882

Jobs in Seremban, Malaysia

Senior Die Attach & Wire Bond Engineer — R2R Leader

Nexperia

Seremban
On-site
MYR 200,000 - 250,000
25 days ago
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Senior Engineer (Wirebond/Die Attach)

Nexperia

Seremban
On-site
MYR 200,000 - 250,000
25 days ago

Quarry Operations & Plant Efficiency Manager

Gemencheh Granite Sdn Bhd

Seremban
On-site
MYR 150,000 - 200,000
25 days ago

Quarry Manager

Gemencheh Granite Sdn Bhd

Seremban
On-site
MYR 150,000 - 200,000
25 days ago

ACCOUNTS MANAGER 会计部经理

Inmax Industries Sdn Bhd

Seremban
On-site
MYR 60,000 - 90,000
26 days ago
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HR Manager

Adecco

Seremban
On-site
MYR 100,000 - 150,000
27 days ago

Manufacturing HR Leader: Strategy, Compliance & Culture

Adecco

Seremban
On-site
MYR 100,000 - 150,000
27 days ago

Territory Sales & Merchandising Specialist (Malaysia)

Nestlé

Seremban
On-site
MYR 100,000 - 150,000
27 days ago
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Sales Representative Gr 2

Nestlé

Seremban
On-site
MYR 100,000 - 150,000
27 days ago

Product Engineering Technician – Power Electronics & Testing

onsemi

Seremban
On-site
MYR 30,000 - 45,000
29 days ago

HR Manager

Sandvik

Seremban
On-site
MYR 80,000 - 100,000
30+ days ago

HR Manager

Sandvik Group

Seremban
On-site
MYR 80,000 - 120,000
30+ days ago

Network Administrator

RiDiK (a Subsidiary of CLPS. Nasdaq: CLPS)

Seremban
On-site
MYR 80,000 - 120,000
30+ days ago

Clinical Receptionist

Ropheka Physiotherapy & Sports Injury Centre

Seremban
On-site
MYR 20,000 - 100,000
30+ days ago

Sourcing Specialist

Sandvik Group

Seremban
On-site
MYR 80,000 - 100,000
30+ days ago

Fleet Operations & Route Optimization Associate

Ninja Van

Negeri Sembilan
On-site
MYR 100,000 - 150,000
12 days ago

Logistics Hub Manager — Operations & People Lead

Ninja Van

Negeri Sembilan
On-site
MYR 100,000 - 150,000
12 days ago

Fleet Operations & Analytics Assistant

Ninja Van

Negeri Sembilan
On-site
MYR 100,000 - 150,000
13 days ago

Strategic HR Partner for Global Manufacturing

Sandvik Group

Seremban
On-site
MYR 80,000 - 120,000
30+ days ago

Finance Executive | Bank | Seremban

J-Recruit Recruitment Agency

Seremban
On-site
MYR 100,000 - 150,000
30+ days ago

Bancassurance Sales Pro - Prospect, Advise & Grow

J-Recruit Recruitment Agency

Seremban
On-site
MYR 100,000 - 150,000
30+ days ago

Bilingual Front Desk & Patient Care - Physiotherapy Clinic

Ropheka Physiotherapy & Sports Injury Centre

Seremban
On-site
MYR 20,000 - 100,000
30+ days ago

Technician, Product Engineering

onsemi

Seremban
On-site
MYR 30,000 - 45,000
30+ days ago

Personal Banker | Mandarin Speaking | Seremban

J-Recruit Recruitment Agency

Seremban
On-site
MYR 100,000 - 150,000
30+ days ago

Relationship Manager, Commercial Banking (Seremban)

AmBank Group

Seremban
On-site
MYR 40,000 - 60,000
30+ days ago

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Senior Die Attach & Wire Bond Engineer — R2R Leader
Nexperia
Seremban
On-site
MYR 200,000 - 250,000
Full time
24 days ago

Job summary

A leading global semiconductor company in Malaysia seeks a Die Bond & Wire Bond Process Equipment Engineer to ensure process performance and equipment uptime. This role includes managing equipment setup, conducting analysis for yield improvement, and collaborating with QA and production teams. Candidates must have a Bachelor's Degree in related fields and 3 years of experience in semiconductor engineering. The position offers a dynamic work environment focused on continuous improvement.

Qualifications

  • Minimum 3 years of experience in Die Attach, Wire Bond, or semiconductor assembly process/equipment engineering.
  • Strong hands-on knowledge of Die Bond and/or Wire Bond machines (Hesse, ASM, Kulicke & Soffa, etc.).
  • Proficiency in statistical tools and data analysis.

Responsibilities

  • Manage tooling setup, equipment calibration, and qualification.
  • Drive continuous improvement and cost reduction projects.
  • Document process procedures and provide training to technicians.

Skills

Die Bond knowledge
Wire Bond knowledge
Process improvement
Problem-solving skills
Analytical skills

Education

Bachelor’s Degree in Mechanical, Electrical, Electronics, Mechatronics, Semiconductor Engineering

Tools

Spotfire
Power BI
Excel
Job description
A leading global semiconductor company in Malaysia seeks a Die Bond & Wire Bond Process Equipment Engineer to ensure process performance and equipment uptime. This role includes managing equipment setup, conducting analysis for yield improvement, and collaborating with QA and production teams. Candidates must have a Bachelor's Degree in related fields and 3 years of experience in semiconductor engineering. The position offers a dynamic work environment focused on continuous improvement.

* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.