Senior Die Attach & Wire Bond Engineer — R2R Leader

Nexperia; Seremban; On-site; MYR 200,000 - 250,000; Full time

Job summary

A leading global semiconductor company in Malaysia seeks a Die Bond & Wire Bond Process Equipment Engineer to ensure process performance and equipment uptime. This role includes managing equipment setup, conducting analysis for yield improvement, and collaborating with QA and production teams. Candidates must have a Bachelor's Degree in related fields and 3 years of experience in semiconductor engineering. The position offers a dynamic work environment focused on continuous improvement.

Qualifications

• Minimum 3 years of experience in Die Attach, Wire Bond, or semiconductor assembly process/equipment engineering.
• Strong hands-on knowledge of Die Bond and/or Wire Bond machines (Hesse, ASM, Kulicke & Soffa, etc.).
• Proficiency in statistical tools and data analysis.

Responsibilities

• Manage tooling setup, equipment calibration, and qualification.
• Drive continuous improvement and cost reduction projects.
• Document process procedures and provide training to technicians.

Skills

Die Bond knowledge

Wire Bond knowledge

Process improvement

Problem-solving skills

Analytical skills

Education

Bachelor’s Degree in Mechanical, Electrical, Electronics, Mechatronics, Semiconductor Engineering

Tools

Spotfire

Power BI

Excel

Job description

A leading global semiconductor company in Malaysia seeks a Die Bond & Wire Bond Process Equipment Engineer to ensure process performance and equipment uptime. This role includes managing equipment setup, conducting analysis for yield improvement, and collaborating with QA and production teams. Candidates must have a Bachelor's Degree in related fields and 3 years of experience in semiconductor engineering. The position offers a dynamic work environment focused on continuous improvement.