Senior Engineer (Wirebond/Die Attach)

Nexperia; Seremban; On-site; MYR 200,000 - 250,000; Full time

Job summary

A leading global semiconductor company in Malaysia seeks a Die Bond & Wire Bond Process Equipment Engineer to ensure process performance and equipment uptime. This role includes managing equipment setup, conducting analysis for yield improvement, and collaborating with QA and production teams. Candidates must have a Bachelor's Degree in related fields and 3 years of experience in semiconductor engineering. The position offers a dynamic work environment focused on continuous improvement.

Qualifications

• Minimum 3 years of experience in Die Attach, Wire Bond, or semiconductor assembly process/equipment engineering.
• Strong hands-on knowledge of Die Bond and/or Wire Bond machines (Hesse, ASM, Kulicke & Soffa, etc.).
• Proficiency in statistical tools and data analysis.

Responsibilities

• Manage tooling setup, equipment calibration, and qualification.
• Drive continuous improvement and cost reduction projects.
• Document process procedures and provide training to technicians.

Skills

Die Bond knowledge

Wire Bond knowledge

Process improvement

Problem-solving skills

Analytical skills

Education

Bachelor’s Degree in Mechanical, Electrical, Electronics, Mechatronics, Semiconductor Engineering

Tools

Spotfire

Power BI

Excel

Job description

Nexperia is a world-class company in semiconductor development and in-house production. A proven global player with an entrepreneurial mentality. At our core is an 13,000+ strong international network with a singular focus. Built on passion and commitment to our work, belief in our goals and a drive to succeed regardless of the challenges we face. We support, reward and challenge individuals equally, in a dynamic and energetic environment.

About the Role

The Die Bond & Wire Bond Process Equipment Engineer is responsible for both process and equipment performance in the Reel-to-Reel (R2R) semiconductor assembly line, where die bond and wire bond stations are connected. The engineer ensures high equipment uptime, process stability, and continuous improvement of yield, UPH, and quality through strong technical ownership, data-driven analysis, and cross‑functional collaboration.

What you will do:

• Own and sustain both Die Attach and Wire Bond processes and equipment, ensuring stable operation, high OEE, and compliance with process specifications.
• Manage tooling setup, equipment calibration, alignment, and qualification.
• Conduct DOE, FMEA, and root cause analysis to resolve yield and quality issues such as die tilt, voids, ball offset, wire lift, and non-stick.
• Optimize bonding parameters and validate process capability (Cpk) for new and existing products.
• Lead setup, conversion, and buy‑off for new products and material changes, ensuring smooth transition between lots and recipes.
• Analyze equipment data (UPH, yield, downtime, alarms) using tools like Spotfire, Power BI, and Excel to identify performance gaps and improvement opportunities.
• Drive continuous improvement and cost reduction projects to enhance productivity, reduce scrap, and sustain process robustness.
• Implement digital controls and interlocks (recipe management, alarm limits, auto‑locks) to prevent human or equipment‑related errors.
• Collaborate with QA, production, and design teams to ensure long‑term process reliability and compliance with customer standards.
• Document process procedures, setup guides, and troubleshooting standards, and provide training and technical support to technicians and operators.
• Prepare and present weekly reports on performance, yield, and improvement actions to management.

What you will need:

• Bachelor’s Degree in Mechanical, Electrical, Electronics, Mechatronics, Semiconductor Engineering or related field.
• Minimum 3 years of experience in Die Attach, Wire Bond, or semiconductor assembly process/equipment engineering (R2R experience is an added advantage).
• Strong hands‑on knowledge of Die Bond and/or Wire Bond machines (e.g., Hesse, ASM, Kulicke & Soffa, Palomar, Shinkawa).
• Solid understanding of bonding parameters, material interactions, thermal profiles, force control, and wire loop formation.
• Experience in equipment troubleshooting, calibration, tooling setup, recipe management, and preventive maintenance.
• Proficiency in statistical tools (DOE, SPC, Minitab, FMEA) and data analysis using Spotfire, Power BI, or Excel.
• Strong problem‑solving skills with ability to perform structured root cause analysis (8D, Ishikawa, 5 Why).
• Familiar with process qualification, Cpk studies, and engineering change management.
• Ability to lead cross‑functional projects and work closely with production, QA, and equipment teams.
• Good communication skills and ability to prepare technical reports and present to management.
• Willing to work in a fast‑paced, high‑volume manufacturing environment with a strong sense of ownership.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright © material and the word Nexperia® is a registered trademark.

D&I Statement

As an equal‑opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested. In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women’s groups. Nexperia is committed to increasing women in management positions to 30% by 2030.