Manufacturing jobs in Malaysia

Req ID: 128403. Location: Senai, Johor, Malaysia. Remote Position: No. Region: Asia.

We seek a seasoned NPI Process Engineer to drive the seamless transition of complex printed circuit board assemblies (PCBA) from design to volume production. You will own NPI readiness for high-mix, low-volume SMT manufacturing, ensuring robust processes, resolving technical roadblocks, and optimizing build efficiency. Your expertise in BOM structures, DFM/DFT, and SMT process excellence will be critical to success.

• Lead end-to-end NPI preparation for SMT-based PCBA products, including process validation, workflow design, and documentation (PFMEAs, control plans, work instructions).
• Conduct DFM/DFT reviews with design teams to mitigate manufacturing risks and optimize BOM/AVL alignment.
• Develop SMT process recipes (stencil design, solder paste, reflow profiles) for complex, mixed-technology assemblies.
• Analyze and validate complex multi-level BOMs, ensuring accuracy, alternate component management, and lifecycle compliance.
• Resolve BOM discrepancies, obsolescence issues, and supply chain challenges during NPI phases.
• Design flexible processes for rapid product changeovers and low-volume efficiency.
• Troubleshoot PCBA defects (solder defects, component placement, ICT/FCT failures) using root-cause analysis (8D, Fishbone).
• Implement statistical process control (SPC) for critical-to-quality (CTQ) parameters in SMT lines.
• Partner with Design, Test, Supply Chain, and Customer to resolve build issues and ensure on-time delivery.
• Mentor junior engineers and technicians on NPI best practices.
• Drive yield improvement, cost reduction, and process scalability initiatives.
• Drive and ensure compliance with quality standards (IPC-A-610, J-STD-001).

• Education: BS/MS in Mechanical, Electrical, Industrial Engineering, or related field.
• Experience: 7+ years in NPI process engineering within PCBA/SMT manufacturing.
• Proven expertise in complex BOM structures (multi-level, configurable, ECO management).
• Hands-on experience with SMT processes (screen printing, SPI, pick-and-place, reflow, AOI, X-ray).
• Track record solving high-mix/low-volume PCBA production challenges.

• DFM/DFT, PFMEA, Process validation
• CAD tools (Valor) and MES
• Root-cause analysis (8D, 5 Whys), SPC, and Lean methodologies
• Familiar Standards: IPC-A-610, IPC-J-STD-001, IPC-7711/21

• Experience with flex/rigid-flex PCBA, press-fit connectors, or box-build integration
• Knowledge of automation solutions for HMLV environments
• Six Sigma Green/Black Belt certification
• Familiarity with Industrial product or medical device manufacturing

This job description is not exhaustive and duties may change. Celestica is an equal opportunity employer. All qualified applicants will receive consideration without discrimination based on protected statuses. Special arrangements can be made for candidates who need it during the hiring process; please indicate needs.

Celestica (NYSE, TSX: CLS) enables the world’s best brands. We partner with leading companies in Aerospace and Defense, Communications, Enterprise, HealthTech, Industrial, Capital Equipment and Energy to deliver solutions for complex challenges. Headquartered in Toronto, Celestica has 40+ locations in 13 countries across the Americas, Europe and Asia.