Lead Principal Engineer Package Technology

Infineon Technologies; Malacca City; On-site; MYR 70,000 - 90,000; Full time

Job summary

A global semiconductor leader in Malaysia is seeking an experienced package engineer to define and coordinate package projects. The ideal candidate will have at least 10 years of experience in IC/semiconductor settings and expertise in semiconductor packaging, assembly, and testing. This role involves generating drawing details, defining package characteristics, and collaborating with technical consultants. Competitive compensation and a diverse work environment are offered.

Qualifications

• 10 years of relevant experience in IC/semiconductor environments.
• Experience in Semiconductor Packaging, Assembly, and Testing.
• Knowledge of Process and Equipment Engineering.
• Experience in Failure Analysis and Reliability Engineering.

Responsibilities

• Generate conceptual package outline and internal construction drawings.
• Define the package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
• Coordinate the package Cost Estimation and Cost Indication.
• Collaborate with partners and technical consultants for package definition.
• Support pre-development and project definition stages.

Skills

Analytical skills

Problem-solving skills

Education

Bachelor’s Degree in Engineering

Job description

Driver for technical definition (BOM, package design, Assembly technology, review PRP, project classification, etc.) activities for package projects with major changes or new packages, considering risks and impacts.

Job Description

In your new role, you will:

1. Generate conceptual package outline and internal construction drawings, finalize and document the drawings, and update the package drawings as needed.
2. Define the package characteristics to meet electrical, thermal, reliability, and mechanical requirements.
3. Coordinate the package Cost Estimation (A1-A3) and Cost Indication (A3).
4. Collaborate with partners and technical consultants for package definition, especially on BE assembly technology know-how.
5. Support pre-development and project definition stages, and serve as the package design expert throughout the project phase.
6. Actively scout for new packaging technologies and stay in touch with package development at competitors/subcontractors.

Your Profile

You are best equipped for this role if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• At least 10 years of relevant experience in IC/semiconductor environments.
• Experience in Semiconductor Packaging, Assembly, and Testing.
• Knowledge of Process and Equipment Engineering.
• Experience in Failure Analysis and Reliability Engineering.
• Strong analytical and problem-solving skills.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions for power systems and IoT, Infineon enables innovative solutions for green and efficient energy, clean and safe mobility, and smart, secure IoT. We drive innovation and customer success while caring for our people and empowering them to achieve ambitious goals. Join us in making life easier, safer, and greener.

Are you in?

We are committed to creating the best Infineon for everyone, embracing diversity and inclusion. We offer a work environment based on trust, openness, respect, and tolerance, providing equal opportunities for all applicants and employees. Recruitment decisions are based on experience and skills.

Please inform your recruiter if there are any specific considerations that could facilitate your participation in the interview process.