Senior Staff and Project/Program Design

Renesas Electronics; Bayan Lepas; Hybrid; MYR 324,000 - 406,000; Full time

Job summary

A leading semiconductor provider based in Malaysia is looking for an experienced individual to lead NPI projects and manage cross-functional teams in the semiconductor packaging sector. Candidates should have a Bachelor's or Master's degree in Electrical Engineering and over 8 years of experience. This role offers a hybrid work model and focuses on innovative product development, enabling candidates to make significant contributions in a flexible environment.

Benefits

Flexible work environment

Opportunities for career advancement

Employee Resource Groups

Qualifications

• 8+ years of experience in semiconductor packaging technology.
• Strong understanding of semiconductor manufacturing flows.
• Proven ability to lead complex, cross-functional programs.

Responsibilities

• Lead cross-functional teams to ensure seamless program execution.
• Manage Engineering Build Request prioritization.
• Coordinate and conduct Project Gate reviews.

Skills

Semiconductor packaging technology

Program/Project Management

Stakeholder management

Analytical skills

Microsoft Office proficiency

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

Project management tools

Job description

Responsibilities

• Lead cross-functional teams across Design, Systems, Validation, Product/Test Engineering, Firmware, Supply Chain, Procurement, and Quality to ensure seamless program execution in NPI projects.
• Lead COGS reduction programs from impact assessment through qualification, PCN, safelaunch, and production ramp – quantifying savings, evaluating ROI, and assessing the business impact of schedule slips and risk scenarios.
• Drive capacity expansion initiatives across global manufacturing sites, aligning engineering, operations, and supply chain to support production scalability.
• Build and manage detailed schedules for NPI, COGS and capacity programs; track progress, remove roadblocks, and implement data‑driven mitigation plans.
• Manage Engineering Build Request prioritization, conducting bi‑weekly reviews with PMO and Business Operations leadership to ensure alignment with organizational priorities.
• Act as a liaison between the product group, operations/supply chain teams, and key OSAT interface teams to ensure alignment, clarity, and seamless execution across all stages of the program.
• Drive sample readiness and ramp readiness, ensuring cross‑functional teams maintain schedules that support committed customer delivery timelines.
• Coordinate and conduct Project Gate reviews, ensuring cross‑functional readiness, milestone alignment, and clear communication of risks and dependencies.
• Oversee wafer fab, assembly, and test operations to ensure timeline adherence, cost efficiency, and quality standards across programs.
• Provide structured leadership updates on program status, risks, and mitigation plans, maintaining accurate schedules and qualification documentation.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, with 8+ years of experience in semiconductor packaging technology and product lifecycle management.
• Strong understanding of semiconductor packaging manufacturing flows – including development and production processes, package architectures, and various package types with prior work experience at an assembly site as a process or integration engineer considered a strong plus.
• Proven ability to lead complex, cross‑functional programs in ambiguous environments, supported by foundational Program/Project Management knowledge (coursework, certification, or equivalent).
• Strong stakeholder management, communication, collaboration, and cross‑functional partnership skills across engineering, operations, supply chain, and OSAT teams.
• Highly analytical with strong organizational, problem‑solving, time‑management, and multitasking capabilities.
• Quick learner with the ability to adopt new tools, systems, and processes efficiently; proficient in Microsoft Office and project management tools.
• Self‑motivated, inquisitive, and committed to continuous personal and professional development.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose ‘To Make Our Lives Easier’. As the industry’s leading expert in embedded processing with unmatched quality and system-level know-how, we have evolved to provide scalable and comprehensive semiconductor solutions for automotive, industrial, infrastructure, and IoT industries based on the broadest product portfolio, including High Performance Computing, Embedded Processing, Analog & Connectivity, and Power.

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
• Make a real impact by developing innovative products and solutions to meet our global customers' evolving needs and help make people’s lives easier, safe and secure.
• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system, including the remote work option and Employee Resource Groups, will help you excel from the first day.

Are you ready to own your success and make your mark?

Join Renesas. Let’s Shape the Future together.

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.