Senior Die Bond Equipment & Process Engineer

Nexperia Malaysia Sdn.Bhd.; Seremban; On-site; MYR 90,000 - 120,000; Full time

Job summary

A semiconductor manufacturing company in Negeri Sembilan is seeking a Senior Die Bond Equipment & Process Engineer. This role requires ownership of die bond equipment and processes to ensure efficient production. Candidates should have at least 5 years of experience in the field, solid hands-on experience in ASM/ADAT equipment, and a strong understanding of semiconductor packaging. The company fosters excellent collaboration and commitment to diversity and inclusion.

Qualifications

• Minimum 5 years of experience in die bond equipment and semiconductor process engineering.
• Proven analytical skills for data-driven decisions.
• Knowledge of semiconductor quality standards and process control.

Responsibilities

• Lead the setup, qualification, and optimization of die bond equipment.
• Develop and improve die attach processes for semiconductor devices.
• Drive continuous improvement initiatives for efficiency and cost-effectiveness.

Skills

Solid hands-on experience in ASM/ADAT die bond equipment

Strong understanding of semiconductor packaging

Statistical knowledge and hands-on experience with JMP, Minitab

Proven problem-solving skills

Excellent communication and collaboration skills

Education

Bachelor’s degree in electrical/electronic engineering or related field

Job description

Senior Die Bond Equipment & Process Engineer

We are seeking a Senior Die Bond Equipment & Process Engineer to join our semiconductor manufacturing team. In this role, you will take ownership of die bond equipment, including buyoff machines, and processes to ensure high-quality, reliable, and efficient production. You will collaborate with R&D, manufacturing, and process teams to support new product introductions, troubleshoot equipment issues, and drive continuous process improvements.

What You Will Do:

• Lead the setup, qualification, and optimization of die bond equipment, including buyoff machines.
• Develop, implement, and improve die attach processes for semiconductor devices.
• Troubleshoot equipment and process issues to maintain high yield and reliability.
• Collaborate with cross‑functional teams to support new product introductions.
• Analyze process and equipment data to identify trends and implement corrective actions.
• Drive continuous improvement initiatives to enhance throughput, efficiency, and cost‑effectiveness.
• Mentor junior engineers and share best practices within the team.
• Ensure compliance with safety, quality, and environmental standards.
• Update FMEA, Control Plan, OCAP, SPC and other related documents for Equipment and Process.
• Participate in internal and external audits.
• Lead cost/MVA projects and other related projects for Equipment and Process.
• Perform other activities assigned by superior.

What You Will Need:

• Bachelor’s degree in electrical/electronic engineering, mechanical engineering, materials science, or a related field.
• Minimum 5 years of experience in die bond equipment and semiconductor process engineering.
• Solid hands‑on experience in ASM/ADAT die bond equipment, including buyoff machines, and process optimization. Other die bond machines are a plus.
• Strong understanding of semiconductor packaging, thermal, and mechanical considerations.
• Proven problem‑solving and analytical skills, with the ability to use data to drive decisions.
• Knowledge of semiconductor quality standards, reliability testing, and process control.
• Statistical knowledge and hands‑on experience in JMP, Minitab, and/or other statistical tools.
• Excellent communication and collaboration skills.

As an equal‑opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.