Mold Engineer (Semiconductor)

ATX Group; Malacca City; On-site; MYR 60,000 - 85,000; Full time

Job summary

A semiconductor packaging company based in Malacca City is seeking an experienced engineer to develop and optimize molding processes. The ideal candidate will have a degree in engineering and 3-5 years of hands-on experience in semiconductor IC packaging. Responsibilities include leading troubleshooting for mold-related defects, supporting continuous improvement initiatives, and collaborating with various teams to ensure compliance with customer requirements. Effective communication skills, especially in Chinese, are a plus.

Qualifications

• Minimum 3–5 years of hands-on experience in semiconductor IC packaging.
• Strong exposure to molding processes.
• Solid understanding of epoxy molding compounds and package reliability.

Responsibilities

• Develop and optimize molding processes for semiconductor packages.
• Lead troubleshooting and analysis for mold-related defects.
• Support customer audits and failure analysis related to molding processes.

Skills

Problem-solving capability

Strong stakeholder management

Communication skills

Data-driven mindset

Education

Degree in Engineering (Mechanical, Materials, Chemical, or equivalent)

Job description

Develop, qualify, and sustain molding processes for semiconductor packages, ensuring compliance with internal standards and customer requirements.

Lead troubleshooting and root-cause analysis for mold-related defects (e.g. voids, delamination, cracks, package warpage).

Support NPI, package transfer, and product change activities, including process setup, validation, and documentation.

Optimize molding parameters, materials, and tooling to improve yield, reliability, and cycle time.

Collaborate with quality, reliability, equipment, and production teams to drive continuous improvement initiatives.

Monitor process capability, SPC trends, and key KPIs; implement corrective and preventive actions where required.

Support customer audits, technical reviews, and failure analysis related to molding processes.

Qualifications & Experience

• Degree in Engineering (Mechanical, Materials, Chemical, or equivalent).
• Minimum 3–5 years of hands-on experience in semiconductor IC packaging, with strong exposure to molding processes.
• Solid understanding of epoxy molding compounds, mold tooling, and package reliability requirements.
• Proven problem-solving capability, data-driven mindset, and ability to operate in a high-volume manufacturing environment.
• Strong stakeholder management and communication skills.
• Ability to communicate in Chinese language a plus point.