New Product Introduction Engineer (Bumping)

TF-AMD Penang; Bayan Lepas; On-site; MYR 70,000 - 90,000; Full time

Job summary

A technology company in Malaysia is seeking a qualified engineer to manage product introduction and ensure design compliance. The ideal candidate should have 3-5 years of experience, strong English skills, and a Bachelor's degree in Engineering. Responsibilities include developing technical proposals, managing product specifications, and overseeing equipment compliance. The role requires collaboration across various departments to ensure smooth product transitions.

Qualifications

• 3-5 years of industrial experience, including 2-3 years’ experience in bumping NPI.
• Familiar with common analysis tools, including SPC, 8D, DOE.
• Possess experience in operating and maintaining relevant equipment.

Responsibilities

• Design specialized graphic fixtures based on product requirements.
• Develop technical proposals for new products.
• Prepare for internal HVM introduction after customer approval.
• Compile technical reports required for new products.
• Define and update the BOM for new products.

Skills

Oral and written skills in English

Organizational skills

Communication skills

Coordination skills

Familiarity with FMEA

Understanding of SPC

Quality management knowledge

Understanding of wafer assembly processes

Education

Bachelor’s degree in Engineering or related

Job description

Job Responsibilities:

1. Responsible for confirming product information and on-site equipment technical specifications related to customer designs.
2. Design specialized graphic fixtures, based on product requirements and equipment performance, ensuring compliance with company design rules, customer product quality requirements, and production capacity.
3. Collect information related to new products from customers.
4. Develop technical proposals for new products, including product structure, processes, equipment, materials, quality control measures, and frequency, along with budget data for review and approval.
5. Develop a plan to produce reliable samples based on the approved technical proposal and oversee its implementation, tracking progress.
6. Compile various technical reports required for the introduction of new products into mass production in accordance with system requirements and archive them.
7. Prepare for internal HVM introduction after customer approval, considering the required production volume and utilizing existing company resources such as equipment, materials, and personnel. This may involve coordination with various company departments.
8. Produce and release various standards for the corresponding product before mass production, in accordance with system requirements.
9. collect data on the early stage of products and monitor early flow products during the start of HVM, transitioning from sample production to batch production smoothly, and addressing any issues that arise during the early stage.
10. Define and update the BOM for new products.

-Language: Oral and written skills in English

-Experience: 3-5 years or above of industrial experience including 2-3 years’ bumping NPI expertise experience in a high paced environment

Job Qualifications:

• Bachelor’s degree and above in Engineering or related.
• Familiar with FMEA, APQP, DOE.
• Understand SPC and possess the ability to perform relevant analyses.
• Master quality management knowledge and common analysis tools, including SPC, 8D, DOE, QC.
• Familiar with MSA system.
• Be well-versed in wafer assembly processes, including process requirements, quality criteria, and relevant materials in use.
• Possess experience in operating and maintaining relevant equipment.
• Understand electrostatic discharge precautions and requirements.
• Demonstrate strong organizational, communication, and coordination skills.
• Possess a foundational understanding of wafer packaging technology.
• Have basic knowledge related to design principles.