Equipment Engineer (Wirebond)

New Era Technology; Selangor; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading technology solutions provider is seeking an experienced Equipment Engineer (Wirebond) to join their team in Selangor, Malaysia. The role involves managing machine specifications, setting up wire bond equipment, and enhancing process efficiency. Applicants must have a degree in Engineering and at least three years of relevant experience in semiconductor assembly. This is a great opportunity to work in a supportive environment focused on growth and innovation.

Benefits

Competitive benefits

Continuous training

Qualifications

• Minimum 3 years of hands-on experience in semiconductor assembly.
• Experience in transitioning products from low to high volume manufacturing.
• Solid understanding of ISO and IATF automotive standards.

Responsibilities

• Manage machine specifications and purchase order controls.
• Set up and qualify new wire bond equipment.
• Troubleshoot and resolve equipment-related quality issues.

Skills

Technical knowledge of semiconductor manufacturing processes

Wire bond machine maintenance

Project management skills

Strong communication skills

Education

Bachelor’s or Master’s degree in Engineering

Tools

Quality tools and methodologies (FMEA, DOE, etc.)

Job description

Overview

Join New Era Technology, where People First is at the heart of everything we do. With a global team of over 4,500 professionals, we’re committed to creating a workplace where everyone feels valued, empowered, and inspired to grow. Our mission is to securely connect people, places, and information with end-to-end technology solutions at scale.

At New Era, you’ll join a team-oriented culture that prioritizes your personal and professional development. Work alongside industry-certified experts, access continuous training, and enjoy competitive benefits. Driven by values like Community, Integrity, Agility, and Commitment, we nurture our people to deliver exceptional customer service.

If you want to make an impact in a supportive, growth-oriented environment, New Era is the place for you. Apply today and help us shape the future of work—together.

Hiring

Equipment Engineer (Wirebond) – Malaysia (Client Location) | New Era Technology

About the Role

New Era Technology is looking for experienced Equipment Engineer (Wirebond) to be deployed at our prestigious clientin Malaysia at their Selangor office.

• Define and manage machine specifications, including purchase order (PO) controls and buy-off procedures.
• Set up and qualify new and existing wire bond equipment to meet production and quality standards.
• Develop and implement machine maintenance specifications and ensure execution of routine and breakdown maintenance.
• Troubleshoot and resolve equipment-related quality issues promptly.
• Sustain equipment performance, including MTBA/MTBF, and ensure optimal machine and process setup for existing products.
• Drive capability improvements, cost reduction, parameter optimization, and technical documentation.
• Lead technical skill development and training for equipment and production personnel.
• Plan and support initiatives to enhance process productivity and efficiency.
• Conduct effective root cause analysis using industry best practices.
• Manage maverick lots and ensure proper lot disposition.
• Maintain and control in-process documentation and systems.
• Deliver machine-related training programs to upskill team members.
• Communicate effectively with customers on equipment and process-related matters.
• Support new product introductions and scale-up from low to high volume manufacturing.
• Coordinate and support internal and external audits.
• Foster a culture of innovation and continuous improvement.
• Bachelor’s or Master’s degree in Engineering (Electronics, Electrical, Mechanical, Mechatronics, Materials, or Manufacturing Engineering).
• Minimum 3 years of hands-on experience in semiconductor assembly, specifically in wire bond equipment and processes.
• Strong technical knowledge of semiconductor manufacturing processes: die sawing, die attach, clip bond, encapsulation, trim & form, marking, testing, and packing.
• Proficient in wire bond machine maintenance, including routine alarms and breakdown recovery.
• Experience in transitioning products from low to high volume manufacturing.
• Familiarity with Power devices, QFN packages, and Flip Chip assembly is a plus.
• Solid understanding of ISO and IATF automotive standards.
• Skilled in quality tools and methodologies: FMEA, DOE, statistical analysis, 8D, 5S, Six Sigma.
• Strong project management, organizational, and interpersonal skills.
• Excellent communication skills—able to present technical concepts confidently to teams and executives.
• Self-motivated, independent, and capable of working with minimal supervision.

Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor

• Nationality: Open for Malaysians only
• Availability: Candidates who can join max in 30-45 days.

How to Apply

Send your updated resume to [e-mail] with the subject line:
Equipment Engineer (Wirebond)-Malaysia

About Us

New Era Technology (www.neweratech.com) is a global IT services provider with a footprint in 80+ countries, delivering cutting-edge digital transformation, consulting, and staffing services across industries

New Era Technology, Inc., and its subsidiaries ("New Era" "we", "us", or "our") in its operating regions worldwide are committed to respecting your privacy and recognize the need for appropriate protection and management of any Personal Data that you may provide us. In this, we are also committed to providing you with a positive experience on our websites and while using our products, services and solutions ("Solutions").

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