POSITION SUMMARY:
Supports the product level FA and NPI. Performs product level root cause analysis to identify if issues are due to components, testing setup, handling, workmanship, or design weaknesses. Provides technical support and verifies proper execution of board and product level tests. Monitors data and develops golden samples to ensure testing setup consistency. Analyzes data from production repair reports and addresses top defects reported by repair personnel. Supports RMA root cause analysis.
RESPONSIBILITIES:
- Plan analysis steps based on background information and application-level results to identify potential failure causes and define FA plans.
- Design detailed FA plans based on nondestructive or preliminary analysis results.
- Develop component or subassembly screening methods to mitigate risks at the product level.
- Review CFA reports to verify conclusions and identify risks or overstress issues at the product level.
- Support revisions to FA plans and evaluation tests if root causes are not identified.
- Participate in meetings with field application engineers and customers to understand failure backgrounds and discuss potential causes.
- Collaborate with suppliers to review root cause analyses and preventative actions.
- Provide technical support to factories, including methods to detect hidden quality issues, such as test coverage and thermal stress analysis.
- Advise on process improvements and quality detection methods.
- Assist Program/Quality Teams in providing feedback to customers regarding NPI analysis results.
- Adhere to organizational policies on quality, safety, conduct, legal, environmental, and 5S standards.
- Perform other duties as assigned.
QUALIFICATIONS:
- Ability to explore and evaluate new process technologies.
- Strong communication skills for internal and external interactions.
- Organized project planning abilities.
- Problem-solving skills.
- Data analysis proficiency.
- Knowledge of power semiconductor devices, PCB, plastic materials, and passive components.
EXPERIENCE:
- Understanding of power and RF electronic circuitry and testing equipment.
- Experience in designing test circuits and fixtures for component testing and reliability assessments.
- Strong data analysis skills, including SPC, PowerBI, and test equipment programming.
- Experience in electronic circuit analysis, semiconductor manufacturing, and FA processes.
EDUCATION:
- Bachelor's Degree in Power/Micro-Electronic Engineering or equivalent experience.