Die Attach Process Engineer — Optimize Bonding & Yield

STMicroelectronics; Johor; On-site; MYR 150,000 - 200,000; Full time

Job summary

A global semiconductor company located in Malaysia is seeking a skilled individual to lead process optimization in die bonding. The ideal candidate should hold a Bachelor's or Master's degree in Engineering and demonstrate strong analytical and collaborative skills. Responsibilities include troubleshooting production issues, optimizing process performance, and developing camera vision parameters. This position requires excellent English communication skills and proficiency in MS Office applications, providing opportunities for growth in a diverse workplace.

Qualifications

• Bachelor’s or master's degree is essential.
• Strong proficiency in MS Excel and Office applications is necessary.
• Demonstrated ability to manage multiple tasks in a fast-paced environment.

Responsibilities

• Lead process optimization for die bonding.
• Troubleshoot die attach line issues and implement solutions.
• Develop camera vision parameters for process quality.

Skills

Analytical skills

Team collaboration

Task management

Education

Bachelor’s or Master’s degree in Engineering (Electrical, Mechanical, Material Engineering)

Tools

MS Excel

Microsoft Office

PowerPoint

Job description

A global semiconductor company located in Malaysia is seeking a skilled individual to lead process optimization in die bonding. The ideal candidate should hold a Bachelor's or Master's degree in Engineering and demonstrate strong analytical and collaborative skills. Responsibilities include troubleshooting production issues, optimizing process performance, and developing camera vision parameters. This position requires excellent English communication skills and proficiency in MS Office applications, providing opportunities for growth in a diverse workplace.