Staff Process Engineer Plasma

Ams Osram; Kulim; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Kulim, Kedah seeks an experienced professional to manage plasma etching processes. Candidates should possess a Bachelor's degree in Engineering and at least 3 years of experience in wafer fabrication specializing in dry plasma etching. The role involves analyzing process deviations, leading improvement activities, and maintaining documentation of processes. Good communication skills in English and Bahasa Malaysia are required.

Qualifications

• Bachelor degree or above in Engineering.
• Min 3 years of experience in wafer fabrication specialized in dry plasma etching.
• Knowledge in 6Sigma DMAIC approach is essential.

Responsibilities

• Primary owner for plasma etching processes in ICP chambers.
• Carry out improvement activities related to plasma etching.
• Analyze root causes for process deviations and defects.

Skills

Problem solving

6Sigma DMAIC approach

SPC

Technical knowledge in electronics

Communication in English and Bahasa Malaysia

Education

Bachelor degree or above in Engineering

Tools

JMP

Minitab

Corenerstone

Job description

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Responsibilities

• Primary owner for plasma etching processes(GaN/SiO2/SiN/ALD film) in ICP chambers.
• Carry out improvement activities related to plasma etching topic (cycle time improvement, CPk improvement, scrap reduction, etag reduction, troughput improvement, cost reduction, new tool start-up and etc).
• Analyze root causes for any process deviations, defects, and yield losses topics related to plasma processes/tools.
• Providing resolution(corrective/preventive action plan) to process issues related to plasma etching.
• Monitor SPC chart and provide improvement plan to ensure Cpk > 1.67
• Maintain and update Standard Operating Procedures (SOPs), process specification, Out of Control Plan(OCAP), FMEA and ECP documents.
• Attend MRB for non-coformance lot disposition and follow up on 8D topic.

Qualifications

• Bachelor degree or above in Engineering.
• Min 3 years of experience in wafer fabrication specialized in dry plasma etching. Experience in PeCVD as an added advantage.
• Technical knowledge in the area of electronics and/or semiconductor wafer fabrication.
• Knowledge of problem solving skill, 6Sigma DMAIC approach.
• Skilled in SPC/8D/6Sigma/DOE and Literate in statistic software such as JMP/Minitab/Corenerstone.
• Good communication skill in English and Bahasa Malaysia.