SRSF Tech Development Engineer: Solder Resist & Lamination

AT&S; Kulim; On-site; MYR 150,000 - 200,000; Full time

Job summary

A global manufacturer's team in Kulim Hi-Tech Park, Malaysia, is seeking a Technology Development Engineer specializing in Solder Resistance Surface Finishing (SRSF). This role involves leading engineering projects, managing processes, and developing new materials for PCB manufacturing. Applicants should have a degree in engineering, strong communication skills, and at least 2 years of related experience. The position offers opportunities for career growth and an attractive compensation package.

Benefits

Personal and professional growth opportunities

Attractive and competitive compensation package

Secure position with long-term career perspective

Qualifications

• More than 2 years of experience in PCB/ICS/Assembly or 7 years in Semiconductor industry.
• Subject matter expert in key processes for PCB/Substrate manufacturing.
• Fluent written and oral English; Mandarin is an advantage.

Responsibilities

• Lead and manage SRSF engineering tasks.
• Communicate directly with customers.
• Guide engineers and assist in their development.
• Coordinate feasibility studies for new projects.

Skills

Project management skills

Analytical skills

Communication skills

Leadership skills

Team working spirit

Adaptability

Education

Bachelor of Engineering (Science, Chemistry, Mechanical, Material, etc.)

Tools

MS Office Package (Excel, PowerPoint, Word)

Job description

A global manufacturer's team in Kulim Hi-Tech Park, Malaysia, is seeking a Technology Development Engineer specializing in Solder Resistance Surface Finishing (SRSF). This role involves leading engineering projects, managing processes, and developing new materials for PCB manufacturing. Applicants should have a degree in engineering, strong communication skills, and at least 2 years of related experience. The position offers opportunities for career growth and an attractive compensation package.