Senior Wire Bond Equipment & Process Engineer

Nexperia Malaysia Sdn.Bhd.; Seremban; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Seremban, Malaysia seeks a Senior Wire Bond Equipment & Process Engineer. You will optimize manufacturing processes and ensure quality in production while collaborating with R&D, process engineering, and manufacturing teams. Ideal candidates will possess a Bachelor's degree, strong experience in wire bonding technology, and excellent problem-solving skills. The role includes leading process improvements, troubleshooting, and mentoring junior engineers, offering a dynamic and inclusive work environment.

Benefits

Employee resource groups

Inclusive work environment

Career development opportunities

Qualifications

• Minimum 5 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper.
• Excellent communication and collaboration skills.

Responsibilities

• Lead setup, qualification, and optimization of wire bonding equipment and processes.
• Develop and implement process improvements to enhance yield and reliability.
• Collaborate with cross-functional teams to support new product introductions.

Skills

Wire bonding technology

Process optimization

Statistical analysis

Problem-solving

Collaboration

Education

Bachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, or related field

Tools

JMP

Minitab

ASM wire bonders

Job description

About the Role:

We are seeking a Senior Wire Bond Equipment & Process Engineer to join our dynamic team. In this role, you will leverage your expertise in wire bonding technology to optimize semiconductor manufacturing processes and ensure the highest quality and reliability in production. You will work closely with cross‑functional teams, including R&D, process engineering, and manufacturing, to drive continuous improvement and innovation.

What You Will Do:

• Lead the setup, qualification, and optimization/CZ/DOE of wire bonding equipment and processes.
• Develop and implement process improvements to enhance yield, reliability, and throughput.
• Troubleshoot, disposition and resolve equipment and process issues in a fast‑paced production environment.
• Collaborate with design, quality, and manufacturing teams to support new product introductions.
• Analyze process data to identify trends and implement corrective or preventative actions.
• Mentor junior engineers and share best practices within the team.
• Ensure compliance with safety, quality, and environmental standards.
• Update FMEA, Control Plan, OCAP, SPC and other related documents for equipment and process.
• Conduct internal and external audit.
• Drive cost / MVA projects and other related projects for equipment and process.
• Perform other activities assigned by superior.

What You Will Need:

• Bachelor’s degree in Electrical/Electronic Engineering, Mechanical Engineering, Materials Science, or a related field.
• Minimum 5 years of experience in wire bonding equipment and semiconductor process engineering.
• Strong understanding of thermosonic and ultrasonic wire bonding techniques for Gold and Copper. Other wire type handling is a plus.
• Solid hands‑on experience in ASM wire bonders, bonder programming, and process optimization. KNS hands‑on experience is a plus.
• Solid analytical and problem‑solving skills, with experience using data to drive decisions.
• Knowledge of semiconductor manufacturing standards, quality control, and reliability testing.
• Statistical knowledge/hand‑on experience in JMP, Minitab and/or other statistical tools.
• Excellent communication and collaboration skills; ability to work across teams.

As an equal‑opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women’s groups. Nexperia is committed to increasing women in management positions to 30% by 2030.