Senior Staff Engineer Package Technology Development

Infineon Technologies; Ipoh; On-site; MYR 60,000 - 80,000; Full time

Job summary

A global leader in semiconductor solutions is seeking to hire an experienced engineer to lead IC package development and new product introduction in Ipoh, Malaysia. The ideal candidate will have a Master's or Bachelor's degree in Engineering and at least 5 years of process development experience in semiconductor packaging. This role involves ensuring adherence to technical, quality, cost, and schedule requirements, while collaborating closely with cross-functional teams. The company emphasizes diversity, inclusion, and career growth opportunities.

Qualifications

• Minimum 5 Years of package/process development in semiconductor packaging.
• Experience with a variety of packages: MEMS, Flip Chip, WLCSP, QFN.
• Working knowledge of DFMEA during design phase.

Responsibilities

• Lead IC package development and new product introduction.
• Ensure project meets customer requirements in terms of timeline, cost, and quality.
• Provide technical direction for problem solving of process and reliability.

Skills

Analytical tools: Delta Analysis, DFMEA, DoE, 8D

AutoCAD for 2D drawing

3D software knowledge (AutoCAD 3D, Inventor, SolidWorks)

Package simulation software (ANSYS, SolidWorks)

Risk mitigation strategy

Education

Master / Bachelor Degree in Engineering

Tools

AutoCAD

ANSYS

SolidWorks

Job description

To lead IC package development and new product introduction at subcons. Ensures that technical, quality, schedule and cost requirements are achieved.

Your Role

• Responsible for all technical aspects of new product/package/new process development.
• Ensure that the project meets customer requirements in terms of timeline, cost and quality.
• Provide and/or review design proposals for package including components.
• Provide technical direction related to problem solving of process and reliability issues.
• Close interaction with the cross functional team for new product design and project roadmaps.
• Work closely with the subcon engineering teams to ensure process readiness and effective execution of development activities to meet Infineon project requirements.

Your Profile

• Master / Bachelor Degree in Engineering (Minimum requirement 5 Years of Package/Process development in Semiconductor packaging).
• Experience in analytical tools: Delta Analysis, DFMEA, DoE, 8D and simulation.
• Proficient in AutoCAD for 2D drawing. Knowledge using 3D software (AutoCAD 3D, Inventor, & SolidWorks) is an advantage.
• Exposure to the development of a wide variety of packages: MEMS packages, Flip Chip, WLCSP, QFN.
• Understanding/Interpretation of package simulation software ( ANSYS & SolidWorks) for FEA & thermal analysis is an advantage.
• Working knowledge of DFMEA during design phase and ability to create strategy to mitigate risk.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.