Senior Engineer Unit Process Engineering Wire Bond

Infineon Technologies; Malacca City; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Malacca is looking for a Wire Bond expert to sustain and improve technology in production. The ideal candidate should have a Bachelor's or Master's in Engineering and over three years of experience in semiconductor manufacturing. Key responsibilities include supporting new technologies and leading quality improvement activities. The role offers a diverse and inclusive work environment with opportunities for growth.

Qualifications

• More than 3 years related experience in Assembly packaging or Semiconductor manufacturing background.

Responsibilities

• Sustains and continuously improves qualified technologies in volume production.
• Supports development of new technologies and ensures smooth take-over into production.
• Accountable for 8D closure of FAR, MRB, DDM and SDCAR.
• Lead yield & quality improvement and cost reduction activities.
• Provide technical consultation and guidance to the team.

Skills

Wire Bond Process

Process & product control

Productivity/process improvement

Equipment Integration

Data Analysis

Education

Bachelor's or Master's degree in Mechanical, Manufacturing, Electronics or related Engineering

Job description

Job Description

Wire Bond expert, responsible to achieve robust and auto-pilot processes.

In your new role you will:

• Sustains and continuously improves qualified technologies in volume production with regards to stability, quality, productivity and yield.
• Supports development of new technologies and ensures smooth take-over into volume production and integration into manufacturing environment.
• Accountable and drive for 8D closure of FAR, MRB, DDM and SDCAR.
• Leading and participating in yield & quality improvement and cost reduction activities.
• As a technical expert in new material, process and method qualification.
• Provide technical consultation and guidance team to ensure team success in daily tasks and projects.

Your Profile

You are best equipped for this task if you have:

• Bachelor\'s or Master degree in Mechanical, Manufacturing, Electronics or related Engineering.
• More than 3 years related experience in Assembly packaging or Semiconductor manufacturing background.
• Wire Bond Process
• Process & product control.
• Productivity/process improvement.
• Equipment Integration.
• Data Analysis (Statistical methods, data mining)

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.