Product Engineering

Chipbond Technology Corporation; Seberang Perai; On-site; MYR 150,000 - 200,000; Full time

Job summary

A semiconductor company in Penang is seeking candidates for various engineering roles, involving coordination with production control and analysis of customer complaints. The ideal candidate should hold a Bachelor's degree in a related engineering field and possess at least 1 year of experience in the semiconductor industry, although fresh graduates are also encouraged to apply. Proficiency in Mandarin and English is essential due to regular communication with the Taiwan headquarters and Mandarin-speaking clients.

Qualifications

• Minimum 1 year of product engineering experience in the semiconductor industry.
• Fresh graduates are encouraged to apply.

Responsibilities

• Coordinate with production control for pilot lots and engineering wafers.
• Analyze customer complaint issues and process improvement results.
• Maintain product specifications and update product specs.

Skills

Proficiency in Mandarin

Proficiency in English

Analytical skills

Team coordination

Education

Bachelor's degree in related engineering field

Job description

BE Team

1. Coordinate with production control for pilot lots, returns, and engineering wafers final out
2. Prepare special process checklists for BE1 and BE2
3. Maintain process station flows
4. Create and modify MES process parameters
5. Drive improvements projects and system enhancement

Bumping Team

1. Support pilot lots, returns, and engineering wafer final outs with production control
2. Maintain product specification, forms, and create EDC entries
3. Modify and maintain process station / machine group settings
4. Update process parameters and product spec
5. Configure backup masks and stencils
6. Manage mask hold/ scrap and product data
7. Set up mass production configurations for new product

FA Team

1. Analyze customer complaint issues
2. Analyze process improvement results
3. Analyze experimental data for new process introduction
4. Manage FA case scheduling and operate FA lab equipment and perform basic troubleshooting
5. Purchase and manage lab consumables (exp: polishing materials, liquid nitrogen, sputter, targets)
6. Maintain lab equipment and environment

Packaging Design Team

1. Evaluate customer specifications (CRN/ CDR), conduct discussion and compile data for customer confirmation
2. Handle systems anomalies (contact and data confirmation)
3. Maintain packaging BOM and material info
4. Evaluate and test new packaging materials / second sources
5. Maintain packaging systems and consolidate PK Verify results for various customers and optimize the workflow
6. Manage shipment without ERP records or with special labelling requirements

Job Requirements

1. Bachelor's degree in related engineering field, with at least 1 year of product engineering working experience in semiconductor industry. Fresh Graduate are encouraged to apply as well.
2. The above positions require proficiency in Mandarin, English, as the position involves frequent coordination and reporting to the Taiwan headquarters and Mandarin-speaking clients.