
Enable job alerts via email!
Generate a tailored resume in minutes
Land an interview and earn more. Learn more
A leading engineering firm in Malaysia is seeking a Principal Process Engineer to drive process enhancements in surface preparation and bonding technologies. Responsibilities include setting up machine programs, analyzing quality findings, and ensuring compliance with industry standards. The ideal candidate holds a Bachelor's degree in Engineering and has at least 15 years of relevant experience, particularly in PCB design and SMT processes. Proficiency in Mandarin is highly valued for effective communication with international teams.
To set up new project Machine program, machine documents and equipments required, ensure authenticity of documents posted to system and officiate new document release.
Respond and initiate ECN chang run.
Analyze root cause & CA on weekly quality finding & submit monthly report.
Liaise with vendor on process quality improvement and machine breakdown solution.
Develop, formulate, evaluate and execute to resolve the systemic issue and enhance process capability to improve yield, quality, productivity and cost.
Drive continuous process improvement and cost reduction programs.
Liaise with other department in any engineering or quality solution.
Provide training to Technician/production for any launching of new process/machine or products.
Initiate SPC project and appoint SPC team to resolve potential non-conformance / quality problem.
Incorporate with design review stage by liaising with designer for idea of the new Jig & Fixture.
Ensure all processes meet industry standards (e.g., IPC-610, ISO9001) and customer specifications.
Sepcial skill required: knowledge in data integration & configuration within each machine, linkage to MES & shop floor system.
Liaise with Customer on product technical aspect and quality requirement.
Competent in process failure analysis, design of stencil and reflow profile optimization.
Liaise with QA Dept. for any NCR or CAR action taken which's related to process issue.
Strong understanding of PCB design, soldering techniques, SMT (Surface Mount Technology), THT (Through-Hole Technology), and other assembly technologies.
Familiarity with quality standards (IPC-610, J-STD-001, etc.) and regulatory requirements.
To ensure the Quality and Environmental Management System and EICC requirement are followed and implemented effectively.
Design, develop, and improve the assembly process for PCBs, including soldering, pick-and-place, inspection, testing, and reflow processes.
Identify and resolve issues in the assembly line related to process inefficiencies, component defects, or assembly errors.
Create and maintain detailed process documents, work instructions, and specifications for all PCB assembly stages.
Strong SMT (Surface Mount Technology) process background, including SMT line setup, optimization, and stencil design.
Knowledge of soldering processes, reflow profiles, AOI, and SPI.
Experience in audio testing, including functional and performance testing of audio products.
Familiarity with audio test equipment and test methodologies would be more advantage.
Ability to speak Mandarin is a strong advantage, especially for communication with suppliers, overseas teams, or manufacturing sites.
Requirement:
Candidate must possess at least Bachelor's Degree, Professional Degree in Engineering Electronic/Mechanical or equivalent.
At least 15 years working experience in same related field.