Process Engineers (Semiconductor/IC Packaging)

ATX Group; Malacca City; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading technology company is seeking Process Engineers with experience in semiconductor and IC Packaging. This position requires candidates with a Bachelor's degree in Electrical, Electronics, or Mechanical Engineering and a minimum of 3-4 years of industrial experience. Responsibilities include developing and optimizing bonding processes, troubleshooting production issues, and supporting new product introductions. Skills in SPC, DOE, and root cause analysis are essential. Knowledge of Mandarin is advantageous due to potential collaboration on projects in China.

Qualifications

• Minimum 3–4 years of industrial experience in process engineering, preferably in semiconductor industry.
• Skilled in process optimization and troubleshooting.
• Ability to communicate in Mandarin is a plus.

Responsibilities

• Develop and optimize die attach/wire bonding processes for high yield.
• Troubleshoot bonding issues and perform root cause analysis.
• Support new product introduction and process qualifications.
• Monitor and improve key parameters across multiple package types.

Skills

SPC

DOE

8D

FMEA

Lean Manufacturing

root cause analysis

Mandarin language

Education

Bachelor’s degree or higher in Electrical, Electronics, or Mechanical Engineering

Job description

Process Engineers (Semiconductor/IC Packaging)

We are looking for process engineers with semiconductor/ IC Packaging experience who are relevant with the following job scope.

Develop and optimize die attach/wire bonding processes for high yield, quality and reliability.

Troubleshoot bonding issues and perform root cause analysis.

Support new product introduction (NPI) and process qualifications.

Monitor and improve key parameters.

Develop, optimize, and sustain end-to-end trim, form, and singulation processes across multiple package types.

Ensure all outputs meet dimensional specifications, coplanarity requirements, and mechanical reliability standards.

Troubleshoot production issues such as bent leads, burrs, cracks, incomplete cuts, misalignment, and other mechanical defects.

Lead NPI builds, process qualifications, tooling validation, and parameter optimization for new product ramps.

Enhance tooling, forming die performance, punch/blade selection, and machine capability to improve throughput, quality, and cost efficiency.

Strengthen governance of key KPIs including dimensional compliance, mechanical yield, edge quality, and scrap performance.

Molding / Laser Marking

Develop and sustain molding and marking processes to ensure stable quality and throughput.

Optimize molding parameters for package integrity and resolve issues such as voids, flash, delamination, or dimensional defects.

Ensure marking quality, alignment, and readability meet customer standards; troubleshoot smudging, fading, or misalignment.

Support NPI and changeovers with proper setup, validation, and documentation.

Monitor equipment health and drive improvements in accuracy, cycle time, and yield.

The ideal candidate will be someone with:

• Bachelor’s degree or higher in Electrical, Electronics, or Mechanical Engineering
• Minimum 3–4 years of industrial experience in process engineering - preferably in semiconductor industry.
• Skilled in SPC, DOE, 8D, FMEA, Lean Manufacturing, and root cause analysis tools.
• Ability to communicate in Mandarin language is a plus, due to possible involvement in China projects.