Deal with cutting‑edge Die Attach and power device assembly processesPlay a crucial role in driving from low‑volume to high‑volume manufacturing.
Responsibilities
- Plan, coordinate, and execute process capability control and continuous improvement activities.
- Monitor and manage daily product and process quality, yield performance, and overall process stability.
- Lead and support yield enhancement and quality improvement initiatives.
- Sustain equipment performance, including MTBA/MTBF, machine setup, and process stability for ongoing production.
- Drive process capability upgrades, cost‑reduction initiatives, parameter optimization projects, and prepare technical documentation.
- Develop and enhance technical skill levels within the team.
- Support productivity and efficiency improvement programs across the operations.
- Perform data analysis using best‑known engineering methodologies to resolve issues efficiently.
- Manage maverick lots and ensure proper lot disposition.
- Maintain accurate in‑process documentation and ensure documentation systems are up to date.
- Conduct effective training for process and product‑related topics.
- Communicate and report product or process updates to customers when required.
- Support new product introduction (NPI) from low‑volume builds to high‑volume mass production.
- Coordinate internal and external audit activities.
- Lead and promote innovation and creative problem‑solving culture within the team.
Qualifications
- Bachelor's or Master's Degree in Mechanical, Mechatronics, Manufacturing, Electrical & Electronics, or related engineering fields.
- Minimum 3 years experience in semiconductor manufacturing/production, preferably in Die Attach / Clip Bond processes and equipment.
- Hands‑on experience transitioning products from low‑volume to high‑volume production.
- Recognized as a technical subject‑matter expert in relevant domains.
- Knowledge of Lean Manufacturing, Six Sigma, RCA, DOE, SPC, 8D, or Project Management is an added advantage.
- Able to work independently with minimal supervision in a cross‑functional environment and manage multiple priorities (e.g., NPI, process improvement).
- Strong communication skills - capable of presenting ideas, data, and plans confidently to teams and management.
- Experience with power devices, QFN packages, or flip‑chip assembly is highly desirable.
- Adaptable to dynamic production environments and evolving tasks.
- Willing to work in Telok Panglima Garang (FIZ), Selangor
Benefits
- Opportunity to work in a large multinational corporation (MNC).
- Permanent role offering stability and growth.
- Collaborative and innovative company culture.
The company is a large organization within the industrial/manufacturing industry, committed to delivering high‑quality products and services. They prioritize innovation and strive for excellence in all aspects of their operations.
If you are passionate about the industrial/manufacturing sector and have the skills to excel as a Process Engineer (Die Attach), we encourage you to apply today!