Principal Engineer Package Technology Development

Infineon Technologies; Ipoh; On-site; MYR 364,000 - 486,000; Full time

Job summary

A global semiconductor leader is looking for a seasoned professional to support TPAK/IDPAK platform projects. This role involves designing power package technologies while providing technical guidance and leadership to partners. Candidates should have over 10 years of experience in package development and project management, with strong knowledge in Automotive quality standards. This position offers the chance to innovate in a diverse and inclusive environment that prioritizes decarbonization and digitalization.

Qualifications

• 10+ years of experience in package development and project management, focusing on New Product Introduction.
• Strong technical knowledge of Back End processes and materials.
• Good understanding of Automotive quality and reliability standards.

Responsibilities

• Design and develop power module and package technologies.
• Provide technical guidance for package technology development.
• Drive technical decision-making for new package technologies.

Skills

Package Design and Development

Technical Advisor

Project Management

Problem-Solving and Analysis

Automotive quality knowledge

Education

Bachelor's or Master's degree in Materials Science or Engineering

Job description

Job Description

To support TPAK/IDPAK platform projects with dual sourcing, cost down, 6to 8-inch wafer conversion TCM and additional customer requirements/qualification for the package.

• Package Design and Development: Design and develop power module and power package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
• Technical Advisor: Provide technical guidance and expertise to OSAT partners package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
• Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
• Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned.
• Project Management: Collaborate closely with subcon partners to identify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope.

Your Profile

You are best equipped for this task if you have:

• Bachelor's or Master's degree in a relevant field, such as Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics.
• Over 10 years of experience in package development, process development (assembly and testing), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects.
• Good technical knowledge of Back End processes & material knowledge in lead frame, AMB, module and power packages and interaction to the different functions (eg. design rules, direct materials and processes qualification).
• Good understanding of Automotive quality / reliability requirements and standards.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.