Principal Engineer Package Technology

Infineon Technologies AG; Malacca City; On-site; MYR 120,000 - 150,000; Full time

Job summary

A global semiconductor leader in Malacca is seeking an experienced professional to drive Technology Integration activities. The ideal candidate will have a Bachelor’s Degree in Engineering and at least 8 years of experience in the IC/semiconductor environment, focusing on Semiconductor Packaging and Process Interactions. Join us to contribute to innovative solutions for green and efficient energy and smart IoT applications.

Qualifications

• 8 years of relevant working experience in IC/semiconductor environment.
• Experience in Semiconductor Packaging, Assembly and Test.
• Excellent technical knowledge of processes and materials in plastic packages.

Responsibilities

• Execute PBC and TPC assessment within A-project development.
• Driver of Package Technology DFMEA for A-project.
• Owner of Risk Interaction assessment and mitigation work packages.

Skills

Semiconductor Packaging

Process Interaction

Technical Knowledge of BE Processes

Risk Assessment

Education

Bachelor’s Degree in Engineering

Job description

Overview

Drive Technology Integration activities to ensure the package fulfil the requirements in the aspect of Process Interactions.

Responsibilities

• Execute PBC and TPC assessment within A-project development.
• Driver of Package Technology DFMEA for A-project.
• Owner of Risk Interaction assessment and mitigation work packages.
• Responsible for the integration of unit processes (BOM and Process) in package platform - Risk assessment, study interactions with other processes and process flow.
• Key working partner for FE in FE/BE for new FE technology, process interaction and integration topics.
• Support Pre development for new Chip technology / new package development within development platform.

Your Profile

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics, Physics).
• 8 years of relevant working experience in IC/semiconductor environment.
• Experience in Semiconductor Packaging, Assembly and Test.
• Excellent technical knowledge of BE processes and materials in plastic packages and interaction to the different functions (interaction between FE-BE / BE-BE processes).
• Excellent technical knowledge of Process and Equipment Engineering.
• Good knowledge on the internal package analysis and first level reliability.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

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