PCB Assembly Subject Matter Expert, Senior Manager (Relocation to Thailand)

Celestica Platform and Cloud Solutions Malaysia Sdn. Bhd.; Penang; On-site; MYR 329,000 - 495,000; Full time

Job summary

A global technology company is seeking a Senior Manager for PCB Assembly to lead technical evaluation and ensure industry compliance. The role requires over 15 years of experience and proficiency in PCB design, SMT processes, and leadership in complex projects. The ideal candidate will collaborate across teams and drive technological innovations in PCB assembly. Join us to shape the future of PCB technology and lead a talented team in Penang, Malaysia.

Qualifications

• 15+ years of overall relevant experience preferred.
• 8+ years of PCBA engineering experience in server and high-speed communication equipment.
• Leadership experience in PCB design and SMT projects.

Responsibilities

• Lead PCB technical evaluation and ensure IPC/JEDEC compliance.
• Coordinate engineering resources across projects and avoid conflicts.
• Conduct training and build PCB/PCBA knowledge base.

Skills

PCB design knowledge

Surface Mount Technology (SMT)

Cross-functional team leadership

Strategic thinking

Communication skills

Education

IPC design certifications (IPC610, IPC‑2221, IPC‑6012)

Tools

DOE tools

Job description

PCB Assembly Subject Matter Expert, Senior Manager (Relocation to Thailand)

As a senior expert in the field of Printed Circuit Board (PCB) and Surface Mount Technology (SMT) assembly, you will play a core role in making PCB technology and SMT assembly decisions, collaborating across teams, and solving problems throughout the entire product lifecycle (from R&D design to mass production management). You will be responsible for the inheritance and innovation of PCB and its SMT assembly technologies, ensuring that the product's PCB design meets the industry's top standards for SMT mass production feasibility and supports large-scale mass production.

Detailed Description

Lead PCB technical evaluation of new products, identify risks, and ensure IPC/JEDEC compliance.

Provide DFx guidance, optimize PCB stack‑up, routing, and pad design for manufacturability.

Lead cross‑functional teams to resolve PCBA issues (ASICs, high‑frequency connectors, flatness, etc.).

Support DOE for SMT process parameters to achieve target yield in mass production.

Design PCBA verification plans, review reliability test results, and develop DOE test standards.

Support certification of alternative components, BOM updates, and PCB adaptability reviews.

Guide setup of PCBA testing in production (AOI, flying probe, calibration) and ensure equipment readiness.

Coordinate engineering resources across projects to avoid conflicts.

Conduct training, build PCB/PCBA knowledge base, and share best practices.

Explore next‑gen PCB technologies (HDI, flexible PCB, VIPPO, large ASIC placement, rework) and validate feasibility.

Strong knowledge of PCB design (stack‑up, impedance, signal/power integrity) and SMT PCBA processes.

Proficient in DOE tools, PCB materials (FR‑4, high‑speed), and mass production processes (immersion gold, OSP, buried/blind vias).

Ability to interpret and revise industry standards (IPC, JEDEC).

Strategic thinking to plan long‑term PCB/SMT technology roadmap.

Strong communication and leadership skills to drive cross‑team collaboration.

Detail‑oriented with ability to turn complex technologies into executable plans.

Capable of training and knowledge transfer on advanced PCB/PCBA methods.

Typical Experience

15+ years of overall relevant experience preferred.

8+ years of PCBA engineering experience in the server, switch, and access switch fields.

Have leadership experience in PCB design and SMT projects for servers and high‑speed communication equipment; have successful cases of solving extremely complex PCBA component placement problems.

Typical Education

Priority will be given to candidates with IPC design certifications (such as IPC610, IPC‑2221, IPC‑6012).