Package Development Manager

Amkor Technology; Selangor; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Selangor is seeking a qualified candidate to oversee package and process improvement activities. The ideal applicant should possess a Masters/Bachelor’s Degree in Engineering and have over 10 years of experience in semiconductor manufacturing and new product development. Strong leadership, critical thinking, and communication skills are essential. Candidates must be willing to work in Telok Panglima Garang, Selangor.

Qualifications

• More than 10 years in semiconductor backend manufacturing experience.
• Experience in lead frame/power packaging design and technology.
• Familiar with industry equipment and technology.

Responsibilities

• Plan and manage package and process improvement activities.
• Review customer product specifications and follow up on implementation.
• Research and propose materials for new product development.

Skills

Critical thinking

Systematic problem-solving

Leadership skills

Presentation skills

Education

Masters/Bachelor’s Degree in Engineering

Tools

Design/simulation tools

Job description

Responsibilities

• Plan, lead and manage package and process improvement and development activities
• Review customers’ new product spec requirements and follow up implementation where applicable
• Research, evaluate and propose materials and equipment suitable to support new product development
• Study and identify department staff’s technical skill requirements
• Effectively communicate company /department direction to respective staff in the department
• Follow up department staff’s compliance on quality, environmental, safety and health programs and activities in the company
• Performs any other functions and activities as may be assigned by supervisor from time to time

Qualifications

• Candidate should possess at least a Masters/Bachelor’s Degree in Engineering (Mechanical/Electrical/Electronics/Microelectronics/Mechatronics/Semiconductor Technology, Material science) or equivalent
• Preferably more than 10 years in semiconductor backend (FOL & EOL) manufacturing/NPI/process & package development experience
• Experienced in lead frame/power packaging design and technology
• Experienced in semiconductor backend material, equipment, process & package development & project management
• Familiar with the common equipment/technology in the industry and possess good knowhow of the equipment features for new package development
• Design/simulation/FA hands-on experience will be an added advantage
• Good in critical thinking and systematic problem-solving skills e.g. DOE, 8D, DMAIC, Process Mapping, FTA, 5-Why, Fish Bond, IS-IS NOT, etc.
• Good leadership, written and verbal presentation skills in English. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings
• Applicants must be willing to work in Telok Panglima Garang (FIZ), Selangor

Interested candidates can send their CV to ***********@amkor.com

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