Director, Product and Test Engineering

Infineon Technologies; Ipoh; On-site; MYR 250,000 - 300,000; Full time

Job summary

A global semiconductor leader is seeking a manager in semiconductor BE packaging with over 15 years of experience and strong leadership skills to drive strategic initiatives. This role involves leading cross-functional teams to enhance yield, cost, and quality of Power Devices and collaborating across global regions. The ideal candidate will have a Bachelor's in Electrical Engineering, with a Master's preferred, and proven analytical skills. Join the journey to innovate for a greener future.

Qualifications

• Minimum 15 years of experience in semiconductor fabrication and/or backend packaging.
• At least 5 years of management experience leading teams.

Responsibilities

• Lead cross-functional teams to improve yield, cost, quality, and testing.
• Support the introduction of new products and processes.
• Collaborate with stakeholders in various regions to meet business objectives.

Skills

Technical expertise in semiconductor fabrication

Leadership skills

Analytical problem-solving

Communication skills

Data-driven decision-making

Education

Bachelor of Science in Electrical Engineering

Master of Science in Electrical Engineering

Job description

Your Role

Key responsibilities in your new role:

• Strong background in semiconductor BE packaging manufacturing and/or fabrication, specifically in Power Devices, with a minimum of 15 years of experience and at least 5 years of management experience.
• Requires exceptional technical expertise, strong leadership skills, and the ability to drive strategic initiatives.
• Responsible for leading cross‑functional teams to develop and implement strategies for yield, cost, quality, and test improvements for Power Modules and Power Chip Embedded (CE) IC products at OSAT subcons in Malaysia, Thailand, Vietnam, China and other countries.
• Supporting introduction of new products, processes, and test methodologies, as well as collaborating with internal stakeholders in USA and Europe to ensure alignment with business objectives.

Your Profile

Qualifications and skills to help you succeed:

• Bachelor of Science in Electrical Engineering or other engineering fields, such as Mechanical Engineering, Computer Engineering, or Materials Science.
• Master of Science (MS) degree in Electrical Engineering or other engineering fields is highly preferred.
• Minimum 15 years of experience in semiconductor fabrication and/or backend packaging, specifically in Power Devices.
• At least 5 years of management experience, with a proven track record of leading high‑performing teams.
• Strong technical skills in semiconductor fabrication, backend packaging, and test engineering, with a deep understanding of Power Devices and Power IC products.
• Excellent leadership and communication skills, with the ability to motivate and inspire teams to achieve exceptional results.
• Strong analytical and problem‑solving skills, with experience in data‑driven decision‑making.
• Ability to work in a fast‑paced environment, with multiple priorities and deadlines.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game‑changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone.

This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant´s experience and skills. Learn more about our various contact channels.

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