Qualification:
- Diploma or Bachelor Degree in Engineering (Mechanical or Manufacturing)
Job Requirements:
- Knowledge in copper etching, photosensitive film imaging processing.
- Experience in lead-frame or PCB etching manufacturing processes.
- Skillful in problem solving techniques using statistical tools and data analysis.
- Familiar with Microsoft Office software and project management skill.
- Must have basic knowledge in Design of Experiment (DOE), SPC and other quality
tools.
- Fresh Graduate are welcome. 2-3 years’ experience in manufacturing
environment would be an advantage.
Reporting Level:
- Head of Technical
Duties & Responsibilities:
1.1 Responsible for manufacturing process at Pilot Hole Stamping, Lamination and
UV Exposure for lead frame at PES.
1.2 To resolve all daily process and products’ quality issue.
1.3 Responsible for improvement programs in Yield, Capacity, Cycle Time and
capability to achieve cost reduction.
1.4 Perform 5W1H methodology to determine root cause and implement
improvement actions on daily production lot rejects.
1.5 Perform evaluation to optimize and improve the manufacturing process
capability and yield for new products.
1.6 Qualify new materials; processes, equipment and system for continue
improvement.
1.7 Establish and generate the process control, process FMEA and operation
work Instruction documentation.
1.8 Perform SPC review.
1.9 Perform other duties that may be assigned by the superior from time to time
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.