Wire Bond Process Engineer: Innovation & Quality

Carsem; Ipoh; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Ipoh, Malaysia, seeks a Wire Bond Development Engineer. The successful candidate will lead process improvements and ensure high-quality wire bonding processes by supervising engineering teams. Responsibilities include developing productivity standards and providing hands-on technical support. Ideal candidates have a Bachelor's in Engineering and at least one year in semiconductor manufacturing, with knowledge of wire bonding processes and statistical methods. This is an excellent opportunity to further your career in a dynamic environment.

Qualifications

• Minimum 1 year of experience in semiconductor manufacturing.
• Hands-on involvement in developing wire bond parameters.
• Knowledge of wire bonding processes, materials, and equipment.

Responsibilities

• Train and supervise engineers and technicians for optimal productivity.
• Provide technical support for process-related issues.
• Develop and monitor process yield and efficiency.
• Drive continuous improvement in processes and sourcing.
• Ensure compliance with customer specifications.

Skills

Analytical skills

Problem-solving skills

Communication skills

Teamwork

Education

Bachelor's Degree in Engineering (Electrical, Electronic, Mechanical, Mechatronic)

Tools

Statistical tools

JMP methodology

Job description

A leading semiconductor company in Ipoh, Malaysia, seeks a Wire Bond Development Engineer. The successful candidate will lead process improvements and ensure high-quality wire bonding processes by supervising engineering teams. Responsibilities include developing productivity standards and providing hands-on technical support. Ideal candidates have a Bachelor's in Engineering and at least one year in semiconductor manufacturing, with knowledge of wire bonding processes and statistical methods. This is an excellent opportunity to further your career in a dynamic environment.