Wire Bond Development Engineer

Carsem; Ipoh; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Ipoh, Malaysia, seeks a Wire Bond Development Engineer. The successful candidate will lead process improvements and ensure high-quality wire bonding processes by supervising engineering teams. Responsibilities include developing productivity standards and providing hands-on technical support. Ideal candidates have a Bachelor's in Engineering and at least one year in semiconductor manufacturing, with knowledge of wire bonding processes and statistical methods. This is an excellent opportunity to further your career in a dynamic environment.

Qualifications

• Minimum 1 year of experience in semiconductor manufacturing.
• Hands-on involvement in developing wire bond parameters.
• Knowledge of wire bonding processes, materials, and equipment.

Responsibilities

• Train and supervise engineers and technicians for optimal productivity.
• Provide technical support for process-related issues.
• Develop and monitor process yield and efficiency.
• Drive continuous improvement in processes and sourcing.
• Ensure compliance with customer specifications.

Skills

Analytical skills

Problem-solving skills

Communication skills

Teamwork

Education

Bachelor's Degree in Engineering (Electrical, Electronic, Mechanical, Mechatronic)

Tools

Statistical tools

JMP methodology

Job description

We are looking for a dedicated and innovative Wire Bond Development Engineer to join our dynamic engineering team. The ideal candidate will play a critical role in leading process improvements, supporting production, and ensuring the highest quality standards in our wire bonding processes.

Key Responsibilities

• Train, guide, and supervise engineers, process technicians, and engineering operators to achieve optimal yield, quality, and productivity through effective teamwork.
• Provide hands-on technical support and solutions for process-related issues.
• Develop and monitor process yield, quality, productivity, and cost efficiency, including handling engineering and qualification lots.
• Drive continuous improvement by developing new processes and sourcing materials or equipment.
• Review and ensure compliance with customer specifications and requirements.
• Improve and develop process flows, update specifications to reflect changes from customer or internal developments.
• Establish standard UPH (Units Per Hour), standard operating procedures, and material requirements for new equipment and processes.
• Take ownership of quality issues such as VOC (Voice of Customer), VOP (Voice of Process), MRB (Material Review Board), and CAPA (Corrective and Preventive Actions), ensuring controls are in place to meet audit expectations.
• Perform other duties and responsibilities as assigned by the immediate superior.

Requirements

• Bachelor's Degree in Engineering (Electrical, Electronic, Mechanical, Mechatronic or related field).
• Minimum 1 year of experience in semiconductor manufacturing, with hands-on involvement in developing wire bond parameters for copper and gold.
• Knowledge of wire bonding processes, materials, and equipment is an advantage.
• Familiar with DOE, RSM, statistical tools, JMP methodology and application.
• Strong analytical, problem-solving, communication skills.
• Able to work in a fast-paced, team-oriented environment.