Senior Wire Bond & Die Attach Process Engineer

Coherent Corp.; Ipoh; On-site; MYR 200,000 - 250,000; Full time

Job summary

A manufacturing leader located in Ipoh, Malaysia, is seeking a skilled engineer to enhance manufacturing processes for Die Attach and Wire Bond. Candidates should possess a Bachelor’s in Electronics or Electrical Engineering with experience in high mix environments. You will be responsible for troubleshooting machinery, improving yield rates, and developing work instructions. This role is fully onsite, offering opportunities for growth and stability within a comprehensive career development program.

Benefits

Competitive compensation program

Career development opportunities

Stable and growth-oriented environment

Qualifications

• Experience in high mix and high volume manufacturing environment preferred.
• Strong problem-solving and analytical skills.
• Hands-on attitude towards machine troubleshooting.

Responsibilities

• Improve Die Attach & Wire Bond Process efficiency.
• Analyze data for engineering reports on products.
• Develop Manufacturing Work Instructions as needed.

Skills

Failure Mode and Effects Analysis (FMEA)

Manufacturing Processes

JMP

Wire Bonding

Minitab

Die

Education

Bachelor of Science/Engineering in Electronics or Electrical

Tools

SAS JMP

Minitab

Job description

A manufacturing leader located in Ipoh, Malaysia, is seeking a skilled engineer to enhance manufacturing processes for Die Attach and Wire Bond. Candidates should possess a Bachelor’s in Electronics or Electrical Engineering with experience in high mix environments. You will be responsible for troubleshooting machinery, improving yield rates, and developing work instructions. This role is fully onsite, offering opportunities for growth and stability within a comprehensive career development program.