Senior Wafer Back-Grind Engineer: Innovate & Optimize

Nexperia; Seremban; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Seremban seeks a Process Engineer to develop and optimize wafer back grinding processes. Ideal candidates will have a bachelor's or master's degree in a related field and 3–5 years of experience in semiconductor process development. Responsibilities include working with cross-functional teams and ensuring compliance with industry standards. The company promotes diversity and inclusive practices in its hiring processes.

Qualifications

• Minimum 3–5 years experience in wafer-level packaging or back-end semiconductor process development.
• Strong knowledge of wafer thinning and related processes.
• Hands-on experience with back grinding equipment.

Responsibilities

• Develop and qualify wafer back grinding processes.
• Support technology transfer to high-volume manufacturing.
• Lead yield improvement and cost-reduction initiatives.
• Perform root cause analysis for yield loss.
• Work closely with packaging design and quality teams.
• Create and maintain process documentation.

Skills

Process Development

Technology Transfer

Process Optimization

Problem Solving

Cross-functional Collaboration

Education

Bachelor’s or Master’s degree in Mechanical Engineering, Materials Science, Microelectronics

Tools

DISCO back grinding equipment

Job description

A leading semiconductor company in Seremban seeks a Process Engineer to develop and optimize wafer back grinding processes. Ideal candidates will have a bachelor's or master's degree in a related field and 3–5 years of experience in semiconductor process development. Responsibilities include working with cross-functional teams and ensuring compliance with industry standards. The company promotes diversity and inclusive practices in its hiring processes.