Senior Staff Engineer Package Technology

Infineon Technologies; Malacca City; On-site; MYR 80,000 - 100,000; Full time

Job summary

A global semiconductor leader in Malacca is seeking a professional for the Package Technology DFMEA role. This position involves owning risk interaction assessments, integrating processes, and providing technical guidance. The ideal candidate holds a Bachelor's Degree in Engineering, has 5+ years' experience in the IC/semiconductor field, and possesses strong communication and collaborative skills. Join us in driving decarbonization and digitalization in a diverse and inclusive work environment.

Qualifications

• 5 years of experience in the IC/semiconductor environment.
• Knowledge of semiconductor packaging, assembly, and testing.
• Experience leading or participating in 8D/problem-solving.

Responsibilities

• Own Risk Interaction assessment and mitigation work packages.
• Integrate unit processes in the package platform for risk assessment.
• Provide technical guidance and assistance in projects.

Skills

Good communication skills

Collaboration skills

Negotiation skills

Solution-finding skills

Experience with 8D & T6s methodology

Education

Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics)

Tools

Knowledge of semiconductor packaging

Knowledge of internal package analysis

Job description

Be the driver of Package Technology DFMEA.

Job Description

In your new role you will:

1. Be the owner of Risk Interaction assessment and mitigation work packages.
2. Integrate unit processes (BOM and Process) in the package platform - risk assessment, study interaction with other processes, process flow.
3. Work as a partner with FE in FE/BE interaction and integration topics.
4. Support pre-development activities for new chip technology.
5. Lead or be a team member in 8D/problem-solving for interaction issues.
6. Provide technical guidance and assistance in projects related to interaction topics.

Your Profile

You are best equipped for this task if you have:

• Bachelor’s Degree in Engineering (Semiconductor Technology, Microelectronics, Automation, Mechanical, Electrical, Electronics Physics).
• Preferably 5 years of experience in the IC/semiconductor environment.
• Knowledge of semiconductor packaging, assembly, and testing.
• Good communication, collaboration, negotiation, and solution-finding skills.
• Experience with 8D & T6s methodology.
• Knowledge of internal package analysis and first-level reliability.

#WeAreIn for driving decarbonization and digitalization.

As a global leader in semiconductor solutions for power systems and IoT, Infineon enables innovative solutions for green energy, safe mobility, and smart IoT. We drive innovation and customer success while caring for our people and empowering them to reach ambitious goals. Join us in making life easier, safer, and greener.

Are you in?

We are committed to creating the best Infineon for everyone. We embrace diversity and inclusion, welcoming everyone for who they are. Our working environment is characterized by trust, openness, respect, and tolerance. We are dedicated to providing equal opportunities, basing our hiring decisions on experience and skills.

Please inform your recruiter if you need any accommodations to participate in the interview process.