Senior Staff Engineer Advanced Package Designer

Infineon Technologies (Penang) Sdn. Bhd.; Bayan Lepas; On-site; MYR 120,000 - 160,000; Full time

Job summary

A leading technology company in Malaysia is seeking a Senior Staff Engineer in Advanced Package Design. The role involves designing and developing semiconductor packages, ensuring manufacturability, and collaborating closely with product engineering teams. Candidates should have a Bachelor's or Master's degree in Electrical or Mechanical Engineering, with a minimum of 5 years of relevant experience. Proficiency in CAD tools and a solid understanding of semiconductor package design principles are essential for this position.

Qualifications

• Minimum 5 years of experience in semiconductor package design, preferably in the semiconductor industry.
• Strong knowledge of semiconductor package design principles including laminate substrate package layout.
• Proficiency in CAD design tools.

Responsibilities

• Design and develop semiconductor packages.
• Collaborate with product engineering teams to understand requirements.
• Ensure that designed packages are manufacturable.

Skills

Semiconductor package design principles

CAD design tools (Cadence, Mentor Graphics)

Analytical and problem-solving skills

Communication and collaboration skills

Education

Bachelor's or Master's degree in Electrical Engineering or Mechanical Engineering

Tools

CAD design tools (Cadence, Mentor Graphics)

Job description

Senior Staff Engineer Advanced Package Designer

Responsibilities

• Design and develop semiconductor packages, including laminate substrate package layout, lead frame design, wire bonding schemes, and flip chip bump design
• Collaborate with product engineering teams to understand product requirements and develop package designs that meet those requirements
• Work with manufacturing teams to ensure that designed packages are manufacturable and meet production yield and quality target
• Develop and maintain design documentation, including package drawings, specifications, and design reports
• Conduct design reviews and ensure that designs meet company standards and industry regulations
• Troubleshoot package-related issues and implement design changes to resolve problems
• Stay up-to-date with industry trends and emerging technologies in semiconductor package design
• Collaborate with suppliers to develop and qualify new package materials and technologies
• Develop and maintain relationships with internal stakeholders, including product engineering, manufacturing, and quality assurance teams

Qualifications

• Bachelor\'s or Master\'s degree in Electrical Engineering, Mechanical Engineering, or related field
• Minimum 5 years of experience in semiconductor package design, preferably in the semiconductor industry
• Strong knowledge of semiconductor package design principles, including laminate substrate package layout, lead frame design, wire bonding schemes, and flip chip bump design
• Proficiency in CAD design tools, such as Cadence or Mentor Graphics
• Experience with design for manufacturability (DFM) and design for testability (DFT) principles
• Strong analytical and problem-solving skills, with the ability to troubleshoot complex package-related issues
• Excellent communication and collaboration skills, with the ability to work effectively with cross-functional teams
• Strong attention to detail and ability to maintain accurate and complete design documentation