Senior Process & Equipment Engineer (Molding)

Nexperia; Seremban; On-site; MYR 80,000 - 120,000; Full time

Job summary

A leading semiconductor company in Malaysia seeks a Senior Process & Equipment Engineer (Molding) responsible for maintaining and optimizing molding equipment in high-volume production. This role demands a Bachelor's degree in engineering, at least 5 years of industry experience including 3 years in EMC molding, and strong leadership abilities. The successful candidate will collaborate with cross-functional teams, lead continuous improvement initiatives, and drive yield enhancements. Join a dynamic team committed to excellence in a fast-paced environment.

Qualifications

• Minimum of 5 years of experience in the semiconductor industry, with at least 3 years specializing in EMC molding equipment.
• Proven experience managing technicians in a 24/7 manufacturing environment.
• Strong understanding of material flow behavior and curing characteristics.

Responsibilities

• Lead the maintenance and optimization of molding equipment.
• Monitor and improve equipment downtime and develop mitigation plans.
• Collaborate with teams to ensure molding equipment readiness for high-volume manufacturing.

Skills

Strong hands-on experience with compression or transfer molding

Proficiency in statistical analysis tools such as JMP and Minitab

Excellent problem-solving and communication skills

Leadership skills in a manufacturing environment

Understanding of mold compound properties

Education

Bachelor’s degree in engineering or a related technical discipline

Tools

JMP

Minitab

Job description

Senior Process & Equipment Engineer (Molding)

As a Senior Equipment Engineer (Molding), you will be responsible for ensuring the reliability, performance, and continuous improvement of molding equipment in a high-volume semiconductor manufacturing environment. This role plays a critical part in supporting new product introductions, driving yield and uptime improvements, and enabling advanced packaging technologies. You will work closely with cross-functional teams including Process Engineering, R&D, NPI, and Product Design.

What You Will Do

• Lead the maintenance, optimization, and continuous improvement of molding equipment across various semiconductor package types.
• Monitor equipment downtime (DT) and develop mitigation plans using MTBF/MTBA analysis; evaluate the effectiveness of scheduled downtime activities and ensure proper verification and buy-off.
• Partner with Process Engineering during product development and qualification to ensure molding equipment readiness for high-volume manufacturing (HVM).
• Collaborate with cross-functional teams to develop, maintain, and update technical documentation, including control plans, process specifications, SOPs, FMEAs, and technical reports.
• Plan and manage technician headcount to support 24/7 manufacturing operations; delegate tasks efficiently and provide clear, transparent updates to stakeholders.
• Mentor and coach technicians to strengthen technical competency and engineering mindset, including KPI setting and annual performance reviews.
• Work closely with R&D, NPI, Product Design, and Reliability teams to align molding equipment capability with package architecture and process requirements.
• Diagnose and resolve molding-related equipment and process issues impacting yield and reliability.
• Support technology, process, and equipment transfer activities and ensure smooth ramp-up to HVM.
• Contribute to process technology roadmaps for advanced packaging, thin form factor solutions, and emerging device architectures.
• Drive continuous improvement initiatives such as MVA, yield improvement, and UPH optimization.
• Manage spare parts inventory, procurement activities, and vendor engagement.
• Liaise with suppliers and vendors for jig and fixture fabrication and closely monitor delivery schedules for spare and non-spare parts.
• Thrive in a fast-paced, high-volume manufacturing environment while maintaining high standards of equipment performance and reliability.

What You Will Need

• Bachelor’s degree in engineering or a related technical discipline.
• Minimum 5 years of experience in the semiconductor industry, with at least 3 years specializing in EMC molding equipment or processes.
• Strong hands-on experience with compression or transfer molding, including thin flat mold, exposed pad, and multi-die packages.
• Proficiency in statistical analysis tools such as JMP and Minitab, with solid technical documentation skills.
• Strong understanding of mold compound properties, material flow behavior, curing characteristics, and interactions with other assembly materials (added advantage).
• Proven leadership skills with experience managing technicians in a 24/7 manufacturing environment.
• Excellent problem-solving, communication, and cross-functional collaboration skills.

As an equal-opportunity employer, Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive, and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all, and we consider all applicants fairly, as well as providing a safe work environment and reasonable adjustments where requested.

In addition, we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Women's groups. Nexperia is committed to increasing women in management positions to 30% by 2030.

Be careful - Don’t provide your bank or credit card details when applying for jobs. Don’t transfer any money or complete suspicious online surveys. If you see something suspicious, report this job ad.

Be careful - Don’t provide your bank or credit card details when applying for jobs. Don’t transfer any money or complete suspicious online surveys. If you see something suspicious, report this job ad.

Be careful - Don’t provide your bank or credit card details when applying for jobs. Don’t transfer any money or complete suspicious online surveys. If you see something suspicious, report this job ad.

Be careful - Don’t provide your bank or credit card details when applying for jobs. Don’t transfer any money or complete suspicious online surveys. If you see something suspicious, report this job ad.

Be careful - Don’t provide your bank or credit card details when applying for jobs. Don’t transfer any money or complete suspicious online surveys. If you see something suspicious, report this job ad.