Senior Process Engineer

SANMINA-SCI SYSTEMS (MALAYSIA) SDN BHD; Seberang Perai; On-site; MYR 200,000 - 250,000; Full time

Job summary

A leading manufacturing solutions provider in Malaysia is seeking a Senior Process Engineer to lead SMT and SOM package development activities. The ideal candidate will have a Bachelor's degree and at least 2 years of hands-on experience in SMT/PCBA development. Key responsibilities include NPI builds, process optimization, and documentation compliance. Excellent analytical and communication skills are essential, along with strong knowledge of SMT processes. This role offers a dynamic work environment and opportunities for professional growth.

Qualifications

• Minimum 2 years of hands-on experience in SMT / PCBA / SOM process development or NPI engineering.
• In-depth knowledge of SMT process fundamentals such as reflow profiling and stencil design.
• Experience with Shadow Moiré warpage analysis and interpreting thermal co-planarity results.

Responsibilities

• Lead SMT process development, optimization, and qualification for SOM and complex PCBA assemblies.
• Plan, execute, and interpret Design of Experiments (DOE) to establish robust process windows.
• Drive NPI builds from prototype to mass production, ensuring full process readiness.

Skills

SMT process knowledge

Shadow Moiré analysis

Design of Experiments (DOE)

Structured problem-solving methodologies

Education

Bachelor’s Degree in Electronics, Manufacturing, or Mechanical Engineering

Job description

Senior Process Engineer / Process Engineer

We are seeking a highly independent and responsible Senior or Principal Process Engineer to lead SMT and SOM (System-on-Module) package development activities.

The selected candidate will be directly responsible for NPI builds, DOE execution, and process development for advanced PCBA assemblies, ensuring excellent yield, quality, and reliability performance.

Strong SMT process knowledge and hands‑on experience in Shadow Moiré analysis for package warpage characterization are essential.

Key Responsibilities

Lead SMT process development, optimization, and qualification for SOM and complex PCBA assemblies.

Plan, execute, and interpret Design of Experiments (DOE) to establish robust process windows.

Drive NPI builds from prototype to mass production, ensuring full process readiness and documentation compliance.

Define, verify, and control critical process parameters such as stencil design, paste selection, and reflow profile optimization.

Perform and analyze Shadow Moiré testing to assess package warpage and thermal deformation impact on assembly yield.

Coordinate with design, material, and quality teams to troubleshoot and implement process improvements.

Conduct DFM/DFT reviews, void reduction trials, and co‑planarity control for advanced packaging.

Maintain accurate PFMEA, Control Plan, Process Flow, and Work Instruction documentation.

Evaluate and qualify materials, solder pastes, fluxes, and SMT equipment in accordance with IPC/JEDEC standards.

Ensure all assigned activities are completed independently, responsibly, and within project timelines.>

Requirements

Bachelor’s Degree in Electronics, Manufacturing, or Mechanical Engineering (or equivalent).

Minimum 2 years hands‑on experience in SMT / PCBA / SOM process development or NPI engineering.

In-depth knowledge of SMT process fundamentals: reflow profiling, stencil design, solder paste rheology, and AOI/SPC control.

Experience in Shadow Moiré warpage analysis and interpreting thermal co‑planarity results.

Skilled in DOE, SPC, CPK, and structured problem‑solving methodologies (DMAIC, 5‑Why, Fishbone).

Familiar with IPC‑A‑610, J‑STD‑001, and JEDEC standards.

Excellent analytical, documentation, and communication skills.

Independent, proactive, and responsible in executing engineering tasks with minimal supervision.

Unlock job insights

Salary match Number of applicants Skills match

Your application will include the following questions:

• What's your expected monthly basic salary?
• How many years' experience do you have as a process engineer?
• How many years' experience do you have as a Head of Printed Circuit Board Assembly?

Sanmina Corporation is a leading integrated manufacturing solutions provider serving the fastest-growing segments of the global Electronics Manufacturing Services (EMS) market. Recognized as a technology leader, Sanmina provides end‑to‑end manufacturing solutions, delivering superior quality and support to Original Equipment Manufacturers (OEMs) primarily in the communications networks, defense and aerospace, industrial and semiconductor systems, medical, multimedia, computing and storage, automotive and clean technology sectors. Sanmina Corporation has facilities strategically located in key regions throughout the world.

Sanmina is an Equal Opportunity Employer and we believe that diversity is critical to our success. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, disability status, protected veteran status, or any other characteristic protected by law.

More information regarding the company is available at http://www.sanmina.com.