Senior Failure Analysis Engineer - IC/Package, Root Cause

Infineon Technologies; Kulim; On-site; MYR 80,000 - 100,000; Full time

Job summary

A leading semiconductor solutions provider in Malaysia is seeking a qualified candidate to perform failure analysis on semiconductor devices. The role involves conducting detailed investigations, preparing analytical reports, and collaborating with cross-functional teams to identify root causes. Candidates should possess a degree in Electrical and Electronic Engineering and have experience in electrical failure verification and localization techniques. Join us to drive innovation and ensure quality in our semiconductor offerings.

Responsibilities

• Perform Discrete/IC Devices Failure Analysis on Package & Die level.
• Prepare FA reports for cross-functional teams.
• Participate in cross-functional meetings presenting FA results.
• Interface with various engineering teams to understand analysis requirements.
• Achieve assigned KPIs.
• Setup application board and product-specific test methodologies.
• Navigate CAD for failure location analysis.
• Conduct Fault Tree Analysis if no physical defect is found.

Skills

Electrical Failure Verification and Localization

Sample preparation

Imaging techniques

Repackaging skill

Basic CAD Navigation System

Semiconductor processing

Education

Degree / Master / PhD in Electrical and Electronic Engineering

Job description

A leading semiconductor solutions provider in Malaysia is seeking a qualified candidate to perform failure analysis on semiconductor devices. The role involves conducting detailed investigations, preparing analytical reports, and collaborating with cross-functional teams to identify root causes. Candidates should possess a degree in Electrical and Electronic Engineering and have experience in electrical failure verification and localization techniques. Join us to drive innovation and ensure quality in our semiconductor offerings.