Semiconductor Mold Engineer: Packaging & Process Optimization

ATX Group; Malacca City; On-site; MYR 60,000 - 85,000; Full time

Job summary

A semiconductor packaging company based in Malacca City is seeking an experienced engineer to develop and optimize molding processes. The ideal candidate will have a degree in engineering and 3-5 years of hands-on experience in semiconductor IC packaging. Responsibilities include leading troubleshooting for mold-related defects, supporting continuous improvement initiatives, and collaborating with various teams to ensure compliance with customer requirements. Effective communication skills, especially in Chinese, are a plus.

Qualifications

• Minimum 3–5 years of hands-on experience in semiconductor IC packaging.
• Strong exposure to molding processes.
• Solid understanding of epoxy molding compounds and package reliability.

Responsibilities

• Develop and optimize molding processes for semiconductor packages.
• Lead troubleshooting and analysis for mold-related defects.
• Support customer audits and failure analysis related to molding processes.

Skills

Problem-solving capability

Strong stakeholder management

Communication skills

Data-driven mindset

Education

Degree in Engineering (Mechanical, Materials, Chemical, or equivalent)

Job description

A semiconductor packaging company based in Malacca City is seeking an experienced engineer to develop and optimize molding processes. The ideal candidate will have a degree in engineering and 3-5 years of hands-on experience in semiconductor IC packaging. Responsibilities include leading troubleshooting for mold-related defects, supporting continuous improvement initiatives, and collaborating with various teams to ensure compliance with customer requirements. Effective communication skills, especially in Chinese, are a plus.