Semiconductor Development Engineer

Ambition; Selangor; On-site; MYR 100,000 - 150,000; Full time

Job summary

A global electronics leader in Selangor is seeking a Packaging Development Engineer to lead R&D initiatives in semiconductor packaging. The ideal candidate will have 3–5 years of experience and expertise in AutoCAD. This role involves collaboration with various teams to ensure process integration and drive packaging innovation, making a significant impact in the industry.

Qualifications

• Minimum 3–5 years of relevant experience in semiconductor packaging development.
• Solid knowledge of packaging flows, with exposure to Die Attach, Wire Bonding, and/or Molding preferred.
• Strong ability to connect different packaging processes and ensure end-to-end integration.

Responsibilities

• Lead R&D initiatives to design, validate, and optimize semiconductor packaging processes.
• Collaborate cross-functionally with manufacturing, tooling, and quality teams.
• Drive yield improvement, cost optimization, and scalability projects within packaging development.

Skills

Semiconductor packaging development

AutoCAD

Structured problem-solving methodologies

Education

Bachelor’s Degree in Engineering

Tools

AutoCAD

Job description

Overview

Are you ready to pioneer next-generation semiconductor packaging solutions?

We are seeking a Packaging Development Engineer (up to Senior level depending on experience) to join a global electronics leader driving cutting-edge innovation in advanced packaging. This role is based in Selangor and offers the opportunity to shape the future of semiconductor technology.

Responsibilities

• Lead R&D initiatives to design, validate, and optimize semiconductor packaging processes across the assembly line — from Front-of-Line (FOL) through Singulation.
• Apply AutoCAD and engineering design skills to develop tooling, evaluate material interactions, and drive packaging integration.
• Execute DOE, process characterization, and failure analysis to enable robust process solutions.
• Collaborate cross-functionally with manufacturing, tooling, and quality teams to ensure seamless upstream and downstream process integration.
• Drive yield improvement, cost optimization, and scalability projects within packaging development.

Qualifications

• Bachelor’s Degree in Engineering (or related field).
• Minimum 3–5 years of relevant experience in semiconductor packaging development.
• Solid knowledge of packaging flows, with exposure to Die Attach, Wire Bonding, and/or Molding preferred.
• Proficiency in AutoCAD and familiarity with structured problem-solving methodologies (8D, Six Sigma, DOE).
• Strong ability to connect the dots across different packaging processes and ensure end-to-end integration.

Why This Role?

• This is a chance to take your semiconductor packaging expertise to the next level in a high-impact role. You’ll be part of a team driving breakthrough developments that shape the industry, while contributing to global manufacturing excellence.

To apply, please click “APPLY NOW” or email Shan Li at [e-mail]. Data provided is for recruitment purposes only.

Due to the volume of applications received, we regret to inform you that only shortlisted candidates will be notified.

JTK Number: JTKSM 995 | Company Registration Number: 201301019088 (1048918-T)