Process Engineer - Wirebond / Die Attach

UST Global; Seberang Perai; On-site; MYR 100,000 - 150,000; Full time

Job summary

A global technology services company is seeking an engineer based in Seberang Perai, Malaysia. You will be responsible for basic machine setups, perform troubleshooting, and monitor performance to ensure optimal operation quality. The ideal candidate must have a Master's or Bachelor's Degree in Mechatronic, Electrical, Electronics, Materials, or Mechanical Engineering, along with at least 2 years of experience. Proficiency in Excel and PowerPoint for reporting purposes is also required.

Qualifications

• Minimum 2 years of experience in relevant field.
• Proficiency in defect analysis and corrective/preventive action.
• Experience with machine performance monitoring and troubleshooting.

Responsibilities

• Setup machines with existing program recipes.
• Perform adjustments to achieve correct specifications.
• Monitor and troubleshoot machine operations.
• Prepare defect analysis reports.

Skills

Basic machine setup

Troubleshooting

Report preparation in Excel and PowerPoint

Defect analysis

Education

Master's/Bachelor's Degree in Mechatronic/Electrical/Electronics/Materials/Mechanical Engineering

Job description

Responsibilities – K&S Iconn Plus / Rapid Wire Bonder

• Basic machine setup with existing program recipe.
• Change wire and capillary after tool limit and perform SPC buyoff to ensure machine running smooth.
• Perform basic machine troubleshooting related to wire bond process.
• Monitor machine performance to ensure smooth operation and good quality output.
• Prepare daily/weekly yield report and defect pareto in Excel and PowerPoint.
• Perform defect analysis to identify possible root cause and provide corrective/preventive action.
• Provide support on any tasks assigned by immediate supervisor or engineer.

Responsibilities – Datacon 2200 Evo Plus

• Basic machine setup with existing program recipe.
• Change and set up ejector needle, perform calibration to ensure no risk of die crack and die pickup problem.
• Perform epoxy stamping parameter adjustment to achieve correct epoxy coverage within spec requirement.
• Perform die placement parameter adjustment to achieve correct die placement within spec requirement.
• Perform basic machine troubleshooting related to die attach process.
• Monitor machine performance to ensure smooth operation and good quality output.
• Prepare daily/weekly yield report and defect pareto in Excel and PowerPoint.
• Perform defect analysis to identify possible root cause and provide corrective/preventive action.
• Provide support on any tasks assigned by immediate supervisor or engineer.

Requirements

Engineer – Masters/Bachelor's Degree in Mechatronic/Electrical/Electronics/Materials/Mechanical Engineering and minimum 2 years of experience.