Principal Engineer Package Technology Development

Infineon Technologies AG; Ipoh; On-site; MYR 120,000 - 150,000; Full time

Job summary

A global semiconductor company in Malaysia is seeking an experienced professional to lead package design and development for Automotive products. The ideal candidate will have over 10 years of experience, along with a strong background in project management and back-end processes. Join us in driving innovation for green energy and safe mobility, while enjoying a diverse and inclusive work environment.

Qualifications

• Over 10 years of experience in package development and project management.
• Good understanding of Automotive quality/reliability requirements.
• Good technical knowledge of materials and processes qualification.

Responsibilities

• Design and develop power module and package technologies.
• Provide technical guidance on package technology development.
• Drive technical decision-making within OSAT.
• Collaborate with partners to resolve technical issues.

Skills

Package development

Project management

Problem-solving

Technical knowledge of Back End processes

Education

Bachelor's or Master's degree in a relevant field

Job description

Job Description

In your new role you will:

• Package Design and Development: Design and develop power module and power package technologies, ensuring optimal performance, reliability, and manufacturability for Automotive products.
• Technical Advisor: Provide technical guidance and expertise to OSAT partners on package technology development, including specifying requirements, developing, verifying, and validating new or modified package technologies.
• Technical Leadership: Drive technical decision-making and set direction within OSAT for the development and pre-development of new package technologies, processes, and materials.
• Problem-Solving and Analysis: Apply a systematic approach to problem-solving, generating analysis, and hypothesis to draw conclusions and derive lessons learned.
• Project Management: Collaborate closely with subcon partners to identify, analyze, and resolve technical issues that may impact project timelines, budgets, or scope.

Your Profile

You are best equipped for this task if you have:

• Bachelor's or Master's degree in a relevant field, such as Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Physics.
• Over 10 years of experience in package development, process development (assembly and testing), and project management, with a focus on New Product Introduction (NPI) and change/transfer projects.
• Good technical knowledge of Back End processes & material knowledge in lead frame, AMB, module and power packages and interaction to the different functions (e.g. design rules, direct materials and processes qualification).
• Good understanding of Automotive quality / reliability requirements and standards.

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener.

Are you in?

We are on a journey to create the best Infineon for everyone. This means we embrace diversity and inclusion and welcome everyone for who they are. At Infineon, we offer a working environment characterized by trust, openness, respect and tolerance and are committed to give all applicants and employees equal opportunities. We base our recruiting decisions on the applicant's experience and skills. Learn more about our various contact channels.

Please let your recruiter know if they need to pay special attention to something in order to enable your participation in the interview process.