Memory Device Failure Analysis Engineer

Sandisk; Batu Kawan; On-site; MYR 50,000 - 70,000; Full time

Job summary

A global data solutions company located in Malaysia is seeking a qualified candidate to perform package and device analysis. The role involves defining Failure Analysis flows, generating reports, and maintaining lab compliance. Ideal candidates will hold a Master’s or Bachelor’s degree in Electrical & Electronic or Material Engineering, and have familiarity with memory product technology. Strong communication skills and English fluency are essential for this position. This role provides an inclusive environment supporting diverse backgrounds.

Responsibilities

• Perform package and device analysis on assembly test defect from production.
• Define the Failure Analysis flow for each case.
• Generate Failure Analysis report and assist teams for root-causing of defect/s.
• Maintain lab in quality system compliance.

Skills

Familiar with package and device analysis methodology

Familiar with memory product technology and structure

Understand memory product test process and methodology

Strong memory IC de-processing skills

Good communication and presentation skills

Teamwork spirit

Fluent in English

Education

Master's / Bachelor’s Degree in Electrical & Electronic or Material Engineering

Job description

A global data solutions company located in Malaysia is seeking a qualified candidate to perform package and device analysis. The role involves defining Failure Analysis flows, generating reports, and maintaining lab compliance. Ideal candidates will hold a Master’s or Bachelor’s degree in Electrical & Electronic or Material Engineering, and have familiarity with memory product technology. Strong communication skills and English fluency are essential for this position. This role provides an inclusive environment supporting diverse backgrounds.