Hardware Package Design Engineer - High-Speed FPGA

Advanced Micro Devices; Penang; On-site; MYR 150,000 - 200,000; Full time

Job summary

A leading technology company in Penang, Malaysia is seeking an experienced package design engineer to join its Adaptive and Embedded Computing Group. This role entails working across chip, technology, and systems to deliver cost-effective and high-performance solutions. Candidates should possess a strong understanding of Cadence tools, PCB layout experience, and a degree in Engineering. The company promotes an inclusive culture and offers competitive benefits for its employees.

Qualifications

• Experience in understanding electrical requirements and translating them to package technology requirements.
• Ability to perform power integrity analysis for core as well as IO.
• Experience mentoring junior package designers.

Responsibilities

• Conduct design using Cadence tools and enable closure of designs.
• Define package/module design requirements during project conception stages.
• Develop multi-signal package/module models.

Skills

Communication skills

Understanding of organic/PCB technologies

Cadence package design tools

High-power, Gbps IO products

2D/3D package design tools

Education

Bachelor's or Master's degree in Engineering

Tools

Cadence

Ansys

AutoCAD

Job description

A leading technology company in Penang, Malaysia is seeking an experienced package design engineer to join its Adaptive and Embedded Computing Group. This role entails working across chip, technology, and systems to deliver cost-effective and high-performance solutions. Candidates should possess a strong understanding of Cadence tools, PCB layout experience, and a degree in Engineering. The company promotes an inclusive culture and offers competitive benefits for its employees.