Equipment Engineer (Die Prep / Surface Mount Technology)

TF AMD; Bayan Lepas; On-site; MYR 80,000 - 100,000; Full time

Job summary

A global technology company in Bayan Lepas, Malaysia is seeking an experienced Engineering Manager to oversee equipment management in semiconductor assembly processes. The role requires a Bachelor's degree and 4-6 years of relevant experience, emphasizing project management, team leadership, and continuous improvement initiatives. Successful candidates will demonstrate a solid understanding of equipment operation and the ability to collaborate with suppliers to achieve quality and cost efficiency. This is a unique opportunity to impact production and drive innovation.

Qualifications

• 4-6 years of industrial experience in equipment development or maintenance.
• Knowledge of Electronic, Electrical or Mechanical Engineering.
• Understanding of semiconductor assembly.
• Skill in equipment operation and maintenance.

Responsibilities

• Manage engineering projects and ensure all equipment requirements are met.
• Oversee equipment operation procedures and maintenance programs.
• Lead team members and manage engineering change control activities.
• Coordinate with suppliers to meet quality and cost management requirements.

Skills

Team management

Project management

Problem-solving

Improvement initiatives

Education

Bachelor's Degree in Mechanical, Electrical, Electronics, or Mechatronics

Job description

Overview

Managing the Assembly Engineering machine related to:
1. Die Prep (Backgrind, Laser, Sawing/Dicing, Pick & Place, 2nd Opt)
2. FOL (SMT, Solder Paste Printing, Chip Cap Attach, Fluxer, Reflow Oven, Flux Clean)

Lead in project management and ensure all requirements in the development or improvement of equipment for processor functional tests are met.

Ensure equipment operation procedures and maintenance programs are in place.

Drive improvements, initiate problem-solving and develop creative engineering solutions to achieve low cost, better quality, improved capabilities, and higher efficiency,

Ensure timely execution of new product or process development and qualification. Demonstrates discipline in the timely execution of tasks.

Manage/audit/liaise with suppliers and vendors to achieve quality, cost and risk management requirements. Plan and manage budgets as well as support capital planning and cost reduction initiatives.

Ensure training and troubleshooting programs on equipment and hardware are in place.

Ensure all requirements are met for smooth equipment implementation in production.

Ensure expectations on production yield, quality, utilization, and cost reduction are met consistently.

Lead, train, and manage a team of equipment/engineering personnel. Enable and manage engineering change control activities.

Work closely with other TF AMD groups and sites to provide effective solutions and support for daily production activities. Demonstrates flexibility/adaptability to frequent changes.

Other duties as assigned by supervisor.

Job Requirements and Must Have

• Bachelor’s Degree in Mechanical, Electrical, Electronics, Mechatronics
• At least 4-6 years and above of industrial experience in equipment development or equipment maintenance experience.
• Good knowledge of Electronic, Electrical or Mechanical Engineering.
• Basic understanding of semiconductor assembly.
• Basic equipment operation and maintenance.
• Help build and maintain effective teams.
• Independent, resourceful and takes initiative.
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