Die Attach Engineer/Senior Engineer -NPI Assembly

STMicroelectronics; Johor; On-site; MYR 60,000 - 80,000; Full time

Job summary

A leading semiconductor company in Johor is seeking a candidate to develop and industrialize new die attach processes and materials for new lead frame packages. The ideal candidate should possess a Master’s or bachelor’s degree in Mechanical, Material, Electrical, or Electronics Engineering. Key responsibilities include qualifying new products and processes, and technical support for quality concerns. The company promotes a diverse workplace and encourages candidates from various backgrounds to apply.

Qualifications

• Experience in soft solder process is an added advantage.
• Strong technical knowledge on process and material know-how.
• Skills in Design of Experiment (DOE) considered beneficial.
• Strong analytical troubleshooting ability is required.
• Good interpersonal skills and ability to work under pressure.

Responsibilities

• Develop and industrialize new die attach process & material for new packages.
• Qualify new package, products, and die attach technology.
• Support qualification/engineering samples for new products or technologies.
• Review and update Process Specification, FMEA, and OCAP.
• Provide technical support for critical quality concerns related to die attach.

Skills

Soft solder process experience

Strong technical knowledge on process and material know-how

Design of Experiment (DOE) in SAS-JMP

Analytical troubleshooting

Good interpersonal skills

Education

Master’s or bachelor’s degree in Mechanical engineering

Material Science

Electrical Engineering

Electronics Engineering or equivalent field

Job description

At STMicroelectronics, we believe in the power of technology to drive innovation and make a positive impact on people, businesses, and society. As a global semiconductor company, our advanced technologies and chips form the hidden foundation of the world we live in today.

When you join ST, you will be part of a global business with more than 115 nationalities, present in 40 countries, and comprising over 50,000 diverse and dedicated creators and makers of technology around the world.

Developing technologies takes more than talent: it takes amazing people who understand collaboration and respect. People with passion and the desire to disrupt the status quo, drive innovation, and unlock their own potential.

Embark on a journey with us, where you can innovate for a future that we want to make smarter and greener, in a responsible and sustainable way. Our technology starts with you.

YOUR ROLE

• To develop and to industrialize new die attach process & material (Soft Solder, Die Attach Glue, Die Attach Film) for new lead frame packages, to meet the yield and quality requirement.
• To qualify new package, products and new die attach technology.
• To support Qualification/ Engineering samples for new packages, new products or new technologies.
• To review and update Process Specification, FMEA, OCAP and Process Control Plan.
• To provide technical support when there is critical quality concern related to Die Attach material or process.

YOUR SKILLS & EXPERIENCES

• Master’s or bachelor’s degree in Mechanical engineering / Material Science / Electrical Engineering / Electronics Engineering or equivalent engineering field.
• Those with soft solder process experience will be an added advantage.
• Strong technical knowledge on process and material know-how.
• Skill in Design of Experiment (DOE) in SAS-JMP will be added advantage.
• Skill in analytical trouble shooting.
• Good interpersonal skills and able to work well under pressure.

ST is proud to be one of the 17 companies certified as a 2025 Global Top Employer and the first and only semiconductor company to achieve this distinction. ST was recognized in this ranking thanks to its continuous improvement approach and stands out particularly in the areas of ethics & integrity, purpose & values, organization & change, business strategy, and performance.

At ST, we endeavor to foster a diverse and inclusive workplace, and we do not tolerate discrimination. We aim to recruit and retain a diverse workforce that reflects the societies around us. We strive for equity in career development, career opportunities, and equal remuneration. We encourage candidates who may not meet every single requirement to apply, as we appreciate diverse perspectives and provide opportunities for growth and learning. Diversity, equity, and inclusion (DEI) is woven into our company culture.