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A technology firm in Singapore is seeking a highly skilled Design Engineer to join its Silicon Engineering team. This role focuses on the design and optimization of SoCs utilizing advanced methodologies. The ideal candidate will possess 4+ years of experience in ASIC physical design and expertise in EDA tools such as Synopsys and Cadence. Benefits include an Employee Stock Purchase Program and comprehensive medical coverage, fostering a great work environment above Tai Seng MRT station.
We are seeking a highly skilled Design Engineer to join our Silicon Engineering team. This role involves driving the design, implementation, and optimization of cutting‑edge SoCs through advanced physical design methodologies. The ideal candidate will have deep expertise in synthesis, floorplanning, place‑and‑route, timing closure, power/performance optimization, and sign‑off flows.
Execute the end‑to‑end physical design flow for complex SoCs and IP blocks (from RTL handoff to GDSII).
Define and drive floorplanning, clock‑tree synthesis (CTS), placement, routing, and timing closure strategies.
Own and optimize power, performance, and area (PPA) metrics for assigned designs.
Manage design constraints, synthesis strategies, and sign‑off criteria (timing, IR drop, EM, DRC/LVS).
Collaborate with front‑end RTL, DFT, verification, and packaging teams to ensure seamless integration.
Drive EDA tool flow automation and methodology enhancements for improved efficiency and scalability.
Mentor and guide junior engineers, fostering technical growth and design excellence.
Work closely with foundries and vendors on process technology bring‑up, PDK updates, and tape‑out readiness.
Bachelor’s or Master’s degree in Electrical Engineering, VLSI, or related field.
4+ years of experience in ASIC physical design
Hands‑on expertise in EDA tools: Synopsys (ICC2, Fusion Compiler, PrimeTime)
Cadence (Innovus, Tempus), or equivalent.
Strong background in timing analysis, low‑power methodologies, and ECO flows.
Solid understanding of architecture‑to‑GDSII flows and sign‑off requirements.
Experience with chip‑level integration and hierarchical design methodologies.
Knowledge of low‑power design techniques (UPF/CPF, power gating, DVFS).
Familiarity with DFT, STA, and physical verification methodologies.
Exposure to multi‑clock, multi‑voltage, and multi‑domain designs.
Excellent problem‑solving and communication skills.
Not only will you be joining a highly skilled and tight‑knit team where every engineer makes a significant impact on the product; we also strive for good work/life balance and to make our environment welcoming and fun.
* The salary benchmark is based on the target salaries of market leaders in their relevant sectors. It is intended to serve as a guide to help Premium Members assess open positions and to help in salary negotiations. The salary benchmark is not provided directly by the company, which could be significantly higher or lower.