Senior Wirebond Manufacturing Process Engineer

Texas Instruments Electronics Malaysia Sdn Bhd; Malacca City; On-site; MYR 80,000 - 100,000; Full time

Job summary

A leading electronics manufacturer in Malacca is seeking a Senior Wirebond Manufacturing Process Engineer to drive continual improvement in manufacturing operations. The role involves developing optimized procedures, supervising process technicians, and enhancing wire bonding processes. Candidates should have a minimum of 5 years' experience in wirebond technology and a relevant engineering degree. Strong communication and teamwork are essential in this fast-paced environment. Competitive pay and benefits are offered.

Benefits

Competitive pay

Comprehensive benefits

Career development opportunities

Qualifications

• Minimum 5 years relevant experience in wirebond process.
• Competent in die attach and wire bonding processes.
• Strong foundation in statistical process control.

Responsibilities

• Support manufacturing operations for wire bonding activities.
• Develop and optimize manufacturing procedures.
• Supervise and lead a team of process technicians.

Skills

Statistical process control

Team collaboration

Time management

Data analytics

Education

Bachelor's degree in relevant engineering field

Tools

Excel

Minitab

Spotfire

JMP

Job description

Senior Wirebond Manufacturing Process Engineer

Texas Instruments Electronics Malaysia Sdn Bhd 4.2 141 reviews · View all jobs

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Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed, highly motivated engineer to join our team.

Overview

The responsibilities of a Manufacturing Process Engineer in this role include supporting manufacturing operations, developing and implementing improved methods of manufacturing, procedures, and processes to improve efficiencies, yields, machine operations, and quality, and driving process optimization for wire bonding activities.

Responsibilities

• Support manufacturing operations
• Develop and implement improved methods of manufacturing, procedures, and processes that result in improved efficiencies, yields, machine operations, and quality
• Develop new automated wire bond programs, optimize process parameters, and recipe standardization
• Support wire bond processes for customer deliverable materials (specialization for different types of bonding, looping, etc.)
• Document wire bond process details in specification(s) and work instructions
• Define applicable wire bond materials for specific applications (wire type, capillary part numbers, etc.)
• Define statistical monitoring methods and automated monitoring methods supporting developed wire bond processes
• Implement project or improvement plans for areas of responsibility including efficiency improvements, cost reduction or quality improvement programs, new product support, process simplification and process system/data analysis automation
• Identify systematic problems in either process or equipment related sources, communicating findings to the engineering staff in a continuous manner, and lead the team to implement systemic actions and monitor throughput
• Support the manufacturing ramp with execution of equipment/process startup, process experiments (SWRs)
• Supervise and lead a team of process technicians

Qualifications

• Minimum 5 years relevant experience in wirebond process
• Competent in the assembly processes of die attach and wire bonding molded devices, knowledge with KNS and ASM Platforms
• Bachelor's degree in Chemical Engineering, Chemistry, Electrical Engineering, Materials Science Engineering, Mechanical Engineering, Physics, or a related field
• Strong foundation in statistical process control, engineering change control and process release strategies
• Strong foundation for data analytic applications
• Competent in using statistical analysis tools (Excel, Minitab, Spotfire, JMP) will be an added advantage

Preferred qualifications

• Goal oriented self-starter with a sense of urgency
• Strong verbal and written communication skills
• Ability to work in teams and collaborate effectively with people in different functions
• Strong time management skills that enable on-time project delivery
• Demonstrated ability to build strong, influential relationships
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results
• Ability to work in fast-paced environment
• Competent in using statistical analysis tools (Excel, Minitab, Spotfire, JMP) – preferred

Why TI?

• Engineer your future. We empower our employees to own their career and development. Collaborate with some of the smartest people to shape the future of electronics.
• We’re different by design. Diverse backgrounds and perspectives push innovation forward. We value every voice.
• Benefits that benefit you. Competitive pay and benefits designed to help you and your family live your best life.

Be Equal Opportunity

Texas Instruments is an equal opportunity employer and supports a diverse, inclusive work environment.

If you are interested in this position, please apply to this requisition.

Minimum 5 years relevant experiences in wirebond process.

Competent in the assembly processes of die attach and wire bonding molded devices, knowledge with KNS and ASM Platforms

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